Semiconductor Joint Assembly with Void-Free Solder Pad Profiles
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Solution Overview
Problem
Conventional joint structures between semiconductor devices often contain gaps, voids, or holes, which compromise their reliability during quality control testing due to the use of conductive materials like solder for bonding.
Innovation Solution
The development of joint structures between semiconductor devices that are substantially free of gaps and voids, achieved by forming contact pads with specific surface profiles and using a thermal process to bond them with a solder layer that matches the pad's surface shape, ensuring a reliable and void-free connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods with conductive materials are used, then electrical connection is achieved, but gaps and voids form compromising reliability
Solution Approach 1:
The contact pads are pre-formed with specific surface profiles (convex, concave, or planar) before the bonding process. This preliminary shaping of the pad surfaces ensures that when the solder layer is applied and heated, the molten solder naturally fills the entire interface area without forming gaps or voids, achieving void-free bonding that enhances joint structure reliability
Solution Approach 2:
The invention changes the surface profile parameter of the contact pads from conventional flat surfaces to specific three-dimensional profiles (convex with protruding portions, concave with recessed portions, or planar). This parameter change in surface geometry enables the solder layer to completely wet and fill the bonding interface during thermal processing, eliminating voids and improving both reliability and manufacturing precision
2Manufacturing precision
If contact pads have specific surface profiles, then void-free bonding is achieved, but manufacturing complexity increases
Solution Approach 1:
The contact pads have different surface profiles at different locations: convex profiles with protruding portions at certain areas, concave profiles with recessed portions at other areas, or planar surfaces. This local variation in surface quality allows the solder to naturally fill bonding interfaces without voids while keeping the overall structure simple and manufacturable through standard semiconductor fabrication processes
Solution Approach 2:
The contact pads incorporate curved surface profiles instead of flat surfaces, including convex profiles with outwardly curved surfaces and concave profiles with inwardly curved surfaces. These curved geometries facilitate complete solder wetting and void-free bonding during the bonding process, achieving high manufacturing precision without significantly increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and quality of the joint structures by eliminating gaps and voids, thereby improving the electrical and physical bonding between semiconductor devices.
Implementation Method 1
using a thermal process to bond them with a solder layer
Data Source
AI summary
A method of manufacturing a semiconductor device structure includes forming a bond or joint between a first device and a second device. The first device comprises an integrated passive device (IPD) and a first contact pad disposed over the IPD. The second device comprises a second contact pad. The first contact pad has a first surface with first lateral extents. The second contact pad has a second surface with second lateral extents. The width of the second lateral extents is less than the width of the first lateral extents. The joint structure includes the first contact pad, the second contact pad, and a solder layer interposed therebetween. The solder layer has tapered sidewalls extending in a direction away from the first surface of the first contact pad to the second surface of the second contact pad. At least one of the first surface or the second surface is substantially planar.