Semiconductor Joint Wettability Layout for Solder Overflow Control
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Solution Overview
Problem
Existing semiconductor devices face challenges in managing variations in height due to dimension and assembly tolerances, leading to overflow of joint materials and potential issues with wet spreading, which can compromise the integrity and efficiency of the joint connections.
Innovation Solution
The semiconductor device incorporates a high wettability region and a low wettability region on the surface of conducting parts, with a holding region to manage surplus joint material, regulating wet spreading and maintaining the joint integrity without requiring trenches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If joint material is applied to connect conducting parts, then reliable electrical connection is achieved, but surplus joint material overflows and spreads uncontrollably due to dimension and assembly tolerances
Solution Approach 1:
The conducting part surface is divided into regions with different wettability characteristics. The first region has high wettability to the joint material, allowing controlled wetting and connection. The second region has low wettability, preventing uncontrolled overflow and spreading. This local differentiation of surface properties enables the joint material to be retained within desired boundaries while maintaining reliable electrical connection.
2Object-generated harmful factors
If trenches are introduced to contain joint material, then joint material overflow is prevented, but device structure becomes more complex
Solution Approach 1:
Instead of introducing structural features like trenches, the invention changes the surface parameter (wettability) of the conducting part. By modifying the surface properties through different plating layers or surface treatments, the joint material's spreading behavior is controlled without adding structural complexity. This approach prevents overflow while maintaining a simple device structure.
3Ease of manufacture
If uniform wettability surface is used on conducting parts, then manufacturing is simplified, but joint material spreads uncontrollably affecting adjacent areas
Solution Approach 1:
The conducting part surface is differentiated into zones with distinct wettability properties. The first region exhibits high wettability, attracting and holding the joint material for effective connection. The second region exhibits low wettability, acting as a barrier that prevents the joint material from spreading into adjacent areas. This local quality differentiation can be achieved through selective plating or surface treatment processes.
4Reliability
If dimension tolerances are tightened to prevent joint material overflow, then joint integrity is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The invention changes the surface wettability parameter of the conducting part to compensate for dimension tolerances. By creating regions with controlled wettability, the joint material's behavior is predictable even with normal dimensional variations. This eliminates the need for tight manufacturing tolerances while maintaining joint integrity, as the wettability-controlled regions guide and contain the joint material appropriately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively holds surplus joint material, ensuring reliable joint connections and improved stability in semiconductor devices, particularly in power converting applications like electric vehicles.
Implementation Method 1
The first conducting part has a high wettability region and a low wettability region in a surface opposite to the second conducting part. The low wettability region is adjacent to the high wettability region and has wettability lower than the high wettability region to the joint material.
Data Source
AI summary
A semiconductor device has a joint part in which a first conducting part and a second conducting part are joined by a joint material. The first conducting part has a high wettability region and a low wettability region in a surface opposite to the second conducting part. The low wettability region is adjacent to the high wettability region to define an outer periphery of the high wettability region and has wettability lower than the high wettability region to the joint material. The high wettability region has an overlap region overlapping a formation region of the joint part in the second conducting part in a planar view, and a non-overlap region connected to the overlap region and not overlapping the formation region of the joint part in the second conducting part. The non-overlap region includes a holding region capable of holding the joint material that is surplus for the joint part.