Semiconductor Device Jumper Terminal Insulation
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Solution Overview
Problem
The reliability of semiconductor devices is compromised due to magnetic fields generated by currents in the wiring, which can lead to malfunctioning, affecting the product characteristics and overall performance.
Innovation Solution
A semiconductor device design featuring a multilayer substrate with jumper terminals and a resin plate that positions semiconductor chips, providing a suitable creepage distance and insulation between jumper terminals, thereby reducing the impact of magnetic fields and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring is provided to electrically connect semiconductor chips, then electrical connection is achieved, but magnetic fields are produced causing malfunctioning
Solution Approach 1:
A resin plate is introduced as an intermediary component between the first and second circuit boards. This resin plate provides insulation and maintains a specific distance between the boards, thereby reducing magnetic field interference while still allowing electrical connection through jumper terminals. The resin plate acts as a mediator that resolves the conflict between achieving electrical connectivity and minimizing harmful magnetic effects.
2Manufacturing precision
If semiconductor chips are positioned on circuit boards, then electrical connection is established, but positioning precision affects product characteristics
Solution Approach 1:
Positioning protrusions are pre-formed on the resin plate before assembly. These positioning protrusions engage with corresponding positioning recesses on the circuit boards to precisely locate the semiconductor chips during assembly. By preparing the positioning features in advance on the resin plate, manufacturing precision is improved without significantly increasing assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively minimizes the influence of magnetic fields, improving the reliability and performance of semiconductor devices by ensuring precise positioning and insulation of semiconductor chips, and facilitating easier assembly and miniaturization.
Implementation Method 1
magnetic fields produced by currents flowing in the wiring provided to electrically connect the semiconductor chips
Implementation Method 2
a resin plate including a first positioning portion that is placed on a front surface of the first circuit board and regulates a position of the first semiconductor chip with respect to the first circuit board
Data Source
AI summary
In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal.