Semiconductor Junction Structure for Bonding Material Intrusion Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in securely bonding control terminals to conductive substrates, leading to potential issues with terminal insertion depth and bonding material intrusion, which affects the reliability and design flexibility of semiconductor devices.
Innovation Solution
The semiconductor device incorporates a conductive substrate with conductive sections and control terminals, where the conductive sections have openings that prevent bonding material from flowing into through-holes, ensuring proper terminal insertion depth and bonding strength, and includes a resin member to enhance design flexibility and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If control terminals are bonded to conductive substrates using conventional methods, then bonding is achieved, but bonding material intrudes into through-holes causing reliability issues
Solution Approach 1:
The conductive substrate is segmented into multiple regions: a through-hole-free first region for terminal bonding and a second region with through-holes for other functions. This spatial segmentation prevents bonding material from intruding into through-holes during the bonding process, eliminating the reliability issue while maintaining the benefits of through-holes in other areas.
Solution Approach 2:
The conductive substrate exhibits local quality differentiation where the first region has a flat surface without through-holes optimized for terminal bonding, while the second region contains through-holes for other purposes. This localized structural variation allows each region to serve its specific function optimally without interfering with the other.
2Reliability
If terminal insertion depth is not precisely controlled, then bonding flexibility is maintained, but bonding strength and reliability are compromised
Solution Approach 1:
The conductive substrate is prepared in advance with a flat first region that is free of through-holes. This preliminary structural preparation ensures that when terminals are bonded, there are no through-holes to cause material intrusion or insertion depth variability, thereby guaranteeing consistent bonding strength without requiring complex insertion control mechanisms.
3Adaptability or versatility
If conventional bonding structures are used, then basic functionality is achieved, but design flexibility in terminal arrangement is limited
Solution Approach 1:
By dividing the conductive substrate into a first region without through-holes and a second region with through-holes, the design enables flexible terminal arrangement in the first region while maintaining manufacturing precision through the flat surface structure, without the constraints of conventional uniform structures.
Data Source
AI summary
A junction structure includes a conductive substrate having a conductive section, a terminal including an electro-conductive tubular holder, and a metal pin inserted into the holder, and a conductive bonding material bonding the conductive section and the holder. The metal pin includes a straight portion extending along a thickness direction of the conductive section. The holder includes a first through-hole extending in the thickness direction, and in which the straight portion of the metal pin is inserted. The conductive section includes a terminal bonding face to which the holder is bonded, and an opening formed in the terminal bonding face. At least a part of an outer peripheral edge of the opening is located on an inner side of an outer peripheral edge of the holder, as viewed in the thickness direction.