Semiconductor Device L-Shaped Input Wiring for Compact Power Conversion

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Solution Overview

Problem

Conventional semiconductor devices for power conversion do not adequately optimize the current path for input and output, leading to inefficiencies and larger device sizes.

Innovation Solution

A semiconductor device configuration with a module substrate featuring specific wiring line arrangements and transistor placements, including L-shaped input wiring lines and strategically positioned transistors, terminals, and control wiring, optimized to reduce size while maintaining efficient current paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the semiconductor device is downsized without optimizing the current path, then the device size is reduced, but the current path efficiency deteriorates

Engineering Contradiction:

Improvesemiconductor device sizeVSAvoidcurrent path efficiency

Core Design Contradiction:

Volume of moving objectVSProductivity

Solution Approach 1:

The patent utilizes the thickness direction (Z-axis) of the substrate to route power wiring lines, creating a three-dimensional wiring structure. This allows current paths to be optimized in multiple dimensions rather than being constrained to a single plane, enabling efficient current flow while maintaining a compact device footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the wiring structure into distinct segments: input wiring lines on the front surface, power wiring lines in the substrate thickness direction, and output wiring lines on the rear surface. This segmentation allows each wiring segment to be independently optimized for its specific function, improving overall current path efficiency while reducing total device size.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If conventional wiring arrangements are used, then manufacturing is simpler, but current path optimization is insufficient

Engineering Contradiction:

Improvewiring structure fabricationVSAvoidpower conversion efficiency

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent replaces complex planar wiring layouts with a vertical three-dimensional wiring architecture. By routing power wiring lines through the substrate thickness direction rather than across the surface, the design achieves superior current path optimization using standard semiconductor fabrication techniques, maintaining ease of manufacture while dramatically improving power conversion efficiency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS10461659B2Semiconductor device and power converting device

Publication Date: 2019.10.29 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

A semiconductor device includes a module substrate, a first input wiring line disposed on a top surface of the module substrate and including a first portion extending along a first side of the module substrate and a second portion extending along a second side that is adjacent to the first side, the second portion having one end that is connected to one end of the first portion, a first input terminal disposed on another end of the second portion and electrically connected to the first input wiring line, first to fourth transistors, first and second output terminals, a second input wiring line disposed on the top surface of the module substrate so as to be close to a fourth side that is opposite to the first side and adjacent to the second side, a second input terminal, and a module sealing member sealing the top surface.