Semiconductor Laminate Bonding to Reduce Substrate Warping
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Solution Overview
Problem
Current semiconductor manufacturing methods face challenges in reducing distortion of multilayer films in memory cell arrays during lithography, leading to deteriorated patterning accuracy and increased manufacturing costs due to substrate warping and the need for additional thinning steps.
Innovation Solution
A manufacturing method involving bonding a first semiconductor element with a higher elastic modulus substrate, such as SiC, to a second substrate, and removing the first substrate to form a laminate, thereby reducing film stress and eliminating the need for substrate thinning, which simplifies the process and improves productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a substrate with low elastic modulus is used, then it is easy to thin the substrate, but the substrate warps causing distortion of multilayer films and deteriorated patterning accuracy
Solution Approach 1:
The patent changes the elastic modulus parameter of the substrate by selecting materials with different mechanical properties. Specifically, it uses a first substrate with a first elastic modulus and a second substrate with a second elastic modulus that is higher than the first, thereby changing the stiffness parameter to prevent warping while maintaining manufacturability
Solution Approach 2:
The patent employs a composite substrate structure consisting of a first substrate and a second substrate with different elastic moduli. This composite structure combines the advantages of both materials: the first substrate provides ease of processing while the second substrate with higher elastic modulus provides dimensional stability and prevents warping during manufacturing
2Ease of operation
If a substrate with low elastic modulus is used, then it is easy to process, but substrate warping occurs leading to increased manufacturing costs
Solution Approach 1:
The patent modifies the elastic modulus parameter by selecting substrates with appropriate mechanical properties. The first substrate maintains ease of processing while the second substrate with higher elastic modulus prevents warping, eliminating the need for complex warping compensation processes and reducing overall manufacturing complexity
Solution Approach 2:
The patent applies preliminary anti-action by pre-combining substrates with different elastic moduli in a specific configuration that counteracts potential warping forces before they occur during processing. This preventive approach avoids the need for corrective measures and simplifies the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces distortion of multilayer films, maintains patterning accuracy, and lowers manufacturing costs by eliminating the need for substrate thinning and reducing warping, while enabling easier reuse of the first substrate.
Implementation Method 1
bonding a first substrate having a first elastic modulus onto a second substrate having a second elastic modulus higher than the first elastic modulus
Data Source
AI summary
A manufacturing method for a semiconductor device including a first semiconductor element and a second semiconductor element, includes the steps of forming an insulating layer on a first substrate having a first elastic modulus higher than a second elastic modulus, forming a first semiconductor element having a first bonding surface on the insulating layer, forming a second semiconductor element having a second bonding surface on a second substrate having the second elastic modulus, bonding the first bonding surface and the second bonding surface to each other to form a laminate of the first semiconductor element and the second semiconductor element, and removing the first substrate from the laminate.