Semiconductor Laminate Structure for Bump-Safe Wafer Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing techniques for three-dimensional semiconductor lamination often result in deformation of bumps during processing due to the use of multiple layers between the semiconductor substrate and the support substrate, which complicates the manufacturing process and efficiency.
Innovation Solution
A laminate structure is developed with a support substrate, a semiconductor substrate having bumps, an inorganic material layer interposed between them, and an adhesive layer with a specific composition that allows for easy separation after processing, reducing the number of layers and minimizing deformation by controlling the adhesive forces between the layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple layers are interposed between the semiconductor substrate and the support substrate, then the adhesive force is sufficient to withstand polishing stress, but the number of layers increases causing bump deformation and process complexity
Solution Approach 1:
The patent merges the functions of multiple layers (separation layer, adhesive layer, and protective layer) into a single integrated layer. This single layer provides both the adhesive strength needed to withstand polishing stress and the separation capability for easy removal, while also protecting the bump structure. The merging reduces the total number of layers from three or more to one, eliminating bump deformation caused by multiple interfaces and simplifying the manufacturing process.
Solution Approach 2:
The patent employs a composite material structure within the single layer, combining materials with different properties to achieve both strong adhesion during polishing and easy separation afterward. The layer includes an adhesive component for bonding to the support substrate and a separation component that allows easy detachment. This composite approach enables the single layer to perform multiple functions that previously required separate layers, reducing complexity while maintaining performance.
2Device complexity
If a single adhesive layer is used between the semiconductor substrate and the support substrate, then the number of layers is reduced, but the bump may deform during processing
Solution Approach 1:
The single layer is constructed as a composite material containing both adhesive components for strong bonding and separation components for easy removal. This composite structure provides the necessary mechanical strength to protect the bump during processing while maintaining the capability for clean separation. The integrated design eliminates the need for multiple layers, reducing interfaces that could cause bump deformation.
Solution Approach 2:
The patent modifies the chemical and physical parameters of the single layer to achieve different adhesive characteristics at different stages. The layer exhibits high adhesion strength during the polishing process to protect the bump, then allows easy separation afterward. By controlling the composition and properties of this single layer, the patent achieves both bump protection and process simplicity without requiring multiple layers.
3Stability of the object's composition
If strong adhesive force is used to prevent wafer displacement during polishing, then the wafer remains stable, but the removal force becomes too large causing wafer damage
Solution Approach 1:
The adhesive function is segmented into two distinct phases within the single layer: a strong bonding phase during polishing that stabilizes the wafer, and a weak separation phase during removal that prevents damage. The layer is designed to switch between these phases, providing high adhesion when needed and easy detachment when required. This segmentation of adhesive strength across different process stages resolves the contradiction between stability and ease of removal.
Solution Approach 2:
The single layer exhibits dynamic adhesive properties that change during the manufacturing process. During polishing, the layer maintains strong adhesion to prevent wafer displacement. During removal, the adhesive force becomes weak, allowing easy separation without damaging the wafer. This dynamic behavior, achieved through specific material composition and structure, enables the layer to adapt its adhesive strength to the process requirements, preventing both wafer displacement and wafer damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses bump deformation and simplifies the manufacturing process by reducing the number of layers, improving product efficiency and maintaining the shape of the bumps during processing.
Implementation Method 1
an adhesive layer interposed between the support substrate and the inorganic material layer and in contact with the support substrate and the inorganic material layer, in which an adhesive force between the inorganic material layer and the adhesive layer when the support substrate and the semiconductor substrate are separated from each other is smaller than an adhesive force between the inorganic material layer and the semiconductor substrate
Data Source
AI summary
There is provided a laminate including: a support substrate; a semiconductor substrate having a bump on a side of the support substrate; an inorganic material layer interposed between the support substrate and the semiconductor substrate and in contact with the semiconductor substrate; and an adhesive layer interposed between the support substrate and the inorganic material layer and in contact with the support substrate and the inorganic material layer, in which the laminate is used for an application in which the support substrate and the semiconductor substrate are separated from each other after processing of the semiconductor substrate in the laminate, and an adhesive force between the inorganic material layer and the adhesive layer when the support substrate and the semiconductor substrate are separated from each other is smaller than an adhesive force between the inorganic material layer and the semiconductor substrate.