Semiconductor Chip With Laminated Coils And Aligned Wires
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The assembly of semiconductor devices with micro transformer elements is challenging due to differences in chip thickness, interlayer insulating film structures, and pad structures, which can lead to wire flow issues during resin molding, increasing assembly complexity.
Innovation Solution
A semiconductor device design featuring a semiconductor chip with a lower layer coil and an upper layer coil laminated through an interlayer insulating film, where a first wire electrically couples the upper layer coil to a circuit unit, and a plurality of second wires couple electrode pads to lead units, with the first wire extending along the direction of the second wires to facilitate assembly and reduce wire flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate semiconductor chips are used (one with micro transformer, one without), then the micro transformer element can be formed, but assembly becomes difficult due to differences in chip thickness, film structures, and pad structures
Solution Approach 1:
The patent combines the micro transformer element and the circuit unit onto a single semiconductor chip. This merging eliminates the need to assemble two separate chips, thereby resolving the assembly complexity issues caused by mismatches in chip thickness, interlayer insulating film structures, and pad structures between separate chips.
Solution Approach 2:
The semiconductor chip is designed to perform multiple functions: it contains both the micro transformer element (with transmission and reception coils) and the circuit unit (transmission or reception circuit). This multi-functional design allows a single chip to replace what would otherwise require multiple separate components, simplifying the overall device structure and assembly process.
2Reliability
If a long wire is used to couple the chips, then electrical connection can be achieved, but wire flow occurs during resin molding
Solution Approach 1:
The patent extracts the circuit unit from a separate chip and integrates it directly onto the same chip as the micro transformer element. This eliminates the need for external wiring to connect separate chips, thereby preventing wire flow issues during resin molding while maintaining reliable electrical connections through short on-chip interconnects.
Solution Approach 2:
The patent uses an on-chip interlayer insulating film and internal wiring structures as intermediaries to connect the micro transformer element and the circuit unit. This intermediary approach replaces long external wires with short controlled interconnects, preventing wire flow during molding while ensuring reliable electrical connection.
3Reliability
If chip thickness and film structures differ between chips, then micro transformer can be formed, but assembly becomes difficult
Solution Approach 1:
By merging the micro transformer element and circuit unit onto a single chip, the patent eliminates the need to match thicknesses and film structures between separate chips. The single-chip architecture ensures uniform thickness and consistent film structures throughout, thereby achieving both reliable micro transformer formation and precise assembly.
Data Source
AI summary
A SOP has a semiconductor chip. The chip includes a pair of a lower layer coil and an upper layer coil laminated through an interlayer insulating film formed therebetween, a first circuit unit electrically coupled to the upper layer coil, and a plurality of electrode pads. Further, it has a wire for electrically coupling the upper layer coil and the first circuit unit, a plurality of inner leads and outer leads arranged around the semiconductor chip, a plurality of wires for electrically coupling the electrode pads of the semiconductor chip and the inner leads, and a resin made sealing member for covering the semiconductor chip. The wire extends along the extending direction of the wires.