Semiconductor Device With Laminated Metal Plates For Cooling
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Solution Overview
Problem
Existing semiconductor devices face inefficiencies in cooling due to the lack of direct connection between cooling members and the center substrate, leading to insufficient cooling and increased module thickness and size.
Innovation Solution
A semiconductor device design featuring multiple metal plates with integrated cooling portions that extend to contact cooling members, allowing for efficient heat transfer and reduced thickness by eliminating the need for large cooling members above and below the chips, and utilizing a cooling liquid flow channel system for enhanced cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large-size cooling members are fitted to the upper and lower sides of the power module, then cooling performance is improved, but the thickness and space size of the power module increases
Solution Approach 1:
The invention transitions from a conventional two-substrate sandwich structure to a three-substrate laminated structure with the center substrate serving as the cooling core. The cooling members are integrated within the module thickness rather than extending beyond it, effectively utilizing the internal dimensional space to achieve cooling without increasing external dimensions.
Solution Approach 2:
The invention merges the cooling function with the center substrate by directly joining cooling members to it. This integration eliminates the need for separate external cooling components and combines the structural support function of the center substrate with the thermal management function, thereby reducing overall module thickness while maintaining cooling performance.
2Device complexity
If cooling members are not connected to the center substrate, then the structure is simpler, but cooling from the center substrate is insufficient
Solution Approach 1:
The center substrate is assigned multiple functions: it serves as both the structural support element and the thermal management core. By joining cooling members directly to the center substrate, the invention makes the center substrate a multi-functional component that simultaneously provides mechanical support and efficient heat dissipation pathways.
Solution Approach 2:
The center substrate acts as an intermediary between the first and second substrates and also as a thermal conduit for the cooling members. This intermediary role allows heat to be efficiently transferred from the power semiconductor devices mounted on the outer substrates to the cooling members, solving the cooling insufficiency problem while maintaining structural integrity.
3Productivity
If three laminated substrates are used with power semiconductor devices between them, then device integration is improved, but heat dissipation path is insufficient
Solution Approach 1:
The invention segments the thermal management function by introducing a dedicated center substrate that is exclusively responsible for heat dissipation. This segmentation allows the first and second substrates to focus on device mounting while the center substrate handles thermal management, creating specialized functional zones that improve overall heat dissipation efficiency.
Solution Approach 2:
The center substrate serves as a thermal intermediary that facilitates heat transfer from the power semiconductor devices on the outer substrates to the cooling members. This intermediary structure creates efficient thermal pathways without compromising the device integration achieved through the laminated substrate configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves efficient cooling of semiconductor chips, reduces module thickness, and minimizes space requirements while maintaining high cooling performance, even for high-power modules.
Implementation Method 1
the first metal plate has a first cooling portion that extends from a portion to which the first semiconductor chip is joined, and is in contact with the cooling member, the second metal plate has a second cooling portion that extends from a portion to which the first semiconductor chip and the second semiconductor chip are joined, and is in contact with the cooling member
Data Source
AI summary
According to the present invention, a semiconductor device includes a first metal plate, a second metal plate provided above the first metal plate, a third metal plate provided above the second metal plate, a first semiconductor chip provided between the first metal plate and the second metal plate, a second semiconductor chip provided between the second metal plate and the third metal plate and a cooling member, wherein the first metal plate has a first cooling portion that is in contact with the cooling member, the second metal plate has a second cooling portion that is in contact with the cooling member, and the third metal plate has a third cooling portion that is in contact with the cooling member.