Semiconductor Device Laminated Resin Structure for Voltage Stability
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Solution Overview
Problem
Conventional semiconductor devices with laminated resin structures face challenges in maintaining accurate image recognition during the packaging process, leading to decreased productivity due to unclear resin layer boundaries, especially with thick second top layers.
Innovation Solution
A semiconductor device with a laminated structure comprising a first resin layer, a second resin layer, and a third resin layer, where the first resin layer is in contact with both the second and third layers around the semiconductor element, facilitating clear boundaries for improved image recognition and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick second resin layer is used to stabilize blocking voltage, then voltage stability is improved, but image recognition accuracy deteriorates due to vague boundaries
Solution Approach 1:
The resin structure is segmented into three distinct layers (first, second, and third resin layers) with clear boundaries. The first resin layer is positioned to contact both the second resin layer and the third resin layer around the center of the semiconductor element, creating visually distinguishable segments that improve image recognition while maintaining voltage stability through the thick second layer configuration
Solution Approach 2:
Different regions of the resin structure are assigned different functions: the second resin layer provides thick coverage for voltage stability, while the first and third resin layers create clear boundary definitions for image recognition. This local differentiation allows each region to optimize its specific function without compromising the other
2Reliability
If conventional laminated resin structures are used, then blocking voltage is stabilized, but manufacturing productivity decreases due to poor image recognition
Solution Approach 1:
The resin structure is divided into three laminated layers with the first resin layer contacting both the second and third layers around the semiconductor element center. This segmentation creates clear visual boundaries that enable accurate image recognition during packaging, thereby improving manufacturing productivity while maintaining the voltage stabilizing function
Data Source
AI summary
In order to improve productivity of a semiconductor device, while improving stability of the blocking voltage of the semiconductor device, this semiconductor device is characterized by having a semiconductor element, and a laminated structure having three resin layers, said laminated structure being in a peripheral section surrounding a main electrode on one surface of the semiconductor element. The semiconductor device is also characterized in that the laminated structure has, on the center section side of the semiconductor element, a region where a lower resin layer is in contact with an intermediate resin layer, and a region where the lower resin layer is in contact with an upper resin layer.