Semiconductor Lamp Driver Circuit Integration on Substrate
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Solution Overview
Problem
Current retrofit lamps face challenges in simplifying electrical contacting of driver circuits with semiconductor light sources and achieving effective heat dissipation, leading to increased component costs and potential mechanical weak points in the production process.
Innovation Solution
Integrating the driver circuit on the same substrate as the semiconductor light sources, eliminating the need for separate carriers and improving heat dissipation by directly attaching the cooling body to the substrate, which reduces heat resistance and component costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the driver circuit is attached to a separate carrier and connected to the LED carrier through the cooling body, then electrical connection is achieved, but the production process becomes complex and requires manual intervention
Solution Approach 1:
The driver circuit is integrated directly onto the substrate (circuit board) instead of being mounted on a separate carrier. This merging of the driver circuit with the substrate eliminates the need for separate carriers and reduces the number of electrical connections required through the cooling body, thereby simplifying the production process and reducing device complexity
2Temperature
If metal core plates are used as LED carriers to improve heat transport, then heat dissipation is improved, but component costs increase
Solution Approach 1:
The LED carrier is removed from the system entirely. Instead of using a separate LED carrier (such as metal core plates), the LEDs are mounted directly on the substrate which also carries the driver circuit. This extraction of the LED carrier eliminates the need for expensive metal core plates while maintaining heat dissipation functionality through the substrate and cooling body
3Temperature
If thin FR4 plates are used as LED carriers to reduce heat resistance, then heat resistance is slightly reduced, but component costs increase and heat transport is not effectively improved
Solution Approach 1:
The substrate serves dual functions as both the circuit board for the driver circuit and the mounting base for the LEDs. This merging eliminates the need for separate FR4 plates or other intermediate carriers, reducing component costs while providing adequate heat dissipation through the substrate and cooling body structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies production, reduces component costs, enhances quality and service life, and facilitates effective heat dissipation, making the semiconductor lamp more economical and reliable.
Implementation Method 1
The cooling body 12 is glued to the substrate 6 by means of an adhesive heat-conductive layer 17
Data Source
AI summary
A semiconductor lamp (1) has at least one semiconductor light source (8) arranged on a front face (7) of a substrate (6) and a driver circuit (11) for activating the at least one semiconductor light source (8), at least part of the driver circuit (11) being secured on a rear face (10) of the substrate (6), facing away from the at least one semiconductor light source (8). The invention can be used, in particular, for retrofit lamps, in particular incandescent- or halogen retrofit lamps.