Semiconductor Lamp Heat Sink Design for Thermal Management
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Solution Overview
Problem
Existing semiconductor lamps face challenges in achieving long lifetime and efficient heat dissipation, leading to reduced brightness and reliability, especially in high-power applications.
Innovation Solution
A semiconductor lamp design featuring a heat sink with a recessed light-emitting semiconductor device thermally coupled to the heat sink, which also serves as the housing, along with an insulating part and a control unit for improved thermal management and electrical insulation, allowing for efficient heat dissipation and protection of electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor device is mounted on a heat sink with thermal coupling, then heat dissipation is improved, but the structural complexity increases
Solution Approach 1:
The housing and heat sink are merged into a single integrated component. The heat sink forms the main body of the housing, eliminating the need for separate housing and heat sink parts. This integration maintains effective thermal coupling while reducing structural complexity and assembly steps.
Solution Approach 2:
The heat sink serves multiple functions simultaneously: it acts as both the thermal management component and the protective housing for the semiconductor device. The recess in the heat sink provides mechanical mounting and environmental protection, while the thermal coupling surface ensures efficient heat dissipation.
2Reliability
If the semiconductor device is protected from mechanical damage, then reliability is improved, but the heat dissipation efficiency may be reduced
Solution Approach 1:
The heat sink features localized thermal coupling surfaces at specific contact points with the semiconductor device, while other regions provide mechanical protection and structural support. The recessed mounting area offers protection without interfering with the critical thermal interface zones.
3Reliability
If the light-emitting semiconductor device is recessed into the heat sink, then protection is improved, but the radiation coupling out may be affected
Solution Approach 1:
The recessed mounting approach moves the semiconductor device into a protected position within the heat sink structure, utilizing the third dimension (depth) to provide protection while maintaining optimal light extraction pathways through carefully designed opening geometries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves an extremely long lifetime for the light-emitting semiconductor component, maintaining or exceeding 50,000 hours of initial brightness, with improved heat dissipation, reliability, and efficiency, while allowing for safe operation and cost-effective production.
Implementation Method 1
the semiconductor device is thermally coupled to the heat sink
Implementation Method 2
a light-emitting semiconductor component on the carrier
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
The invention relates to a semiconductor lamp (2) having a light-emitting semiconductor device, the semiconductor device comprising a carrier (3) and at least one light-emitting semiconductor component (4) on the carrier, and a heatsink (1), wherein the heatsink has a first main face (101), the semiconductor device is located adjacent to the first main face, the carrier facing the first main face, the semiconductor device is thermally coupled to the heatsink, and the heatsink has at least one feedthrough (110) for electrical connection of the semiconductor device.