Semiconductor Package Lane Swapping for Impedance Matching
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Solution Overview
Problem
High-performance semiconductor packages require optimized lane design to maintain high data transmission rates, but existing designs face challenges in impedance matching and energy efficiency due to increased data processing speeds and complexities, necessitating improved design optimality for both lanes and semiconductor chips.
Innovation Solution
A semiconductor package with a semiconductor chip that includes transmission and reception pads, lanes, and option pads, allowing for selective signal or connection swapping based on input from option pads, which adjusts the electrical connection relationships between pads and terminals to enhance design optimality by fixing correspondence relationships and reducing energy loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If data transmission rate is increased to achieve high performance and high capacity, then productivity is improved, but loss of energy increases and manufacturing precision deteriorates due to impedance matching difficulties
Solution Approach 1:
The patent applies dynamics by making the electrical connection relationships switchable between variable and fixed states. The semiconductor chip can dynamically adjust its connection configuration based on operating conditions, allowing optimization of energy efficiency at different data transmission rates while maintaining high productivity through adaptive impedance matching.
Solution Approach 2:
The patent changes physical parameters by switching the electrical connection relationships between variable and fixed states. This parameter change enables optimization of impedance matching and energy efficiency at different operating conditions, resolving the contradiction between high data transmission rate and energy loss.
2Productivity
If data transmission rate is increased to achieve high performance, then productivity is improved, but manufacturing precision deteriorates due to lane design optimization challenges
Solution Approach 1:
The patent makes the lane configuration dynamic by enabling switching between variable and fixed electrical connection relationships. This allows the lane design to be optimized for different data transmission rates, maintaining manufacturing precision even as productivity increases through higher transmission speeds.
Solution Approach 2:
The patent changes the electrical connection parameters from fixed to switchable between variable and fixed states. This parameter change enables re-optimization of lane design at different operating points, resolving the contradiction between high data transmission rate and lane design optimality.
3Adaptability or versatility
If electrical connection relationships are made variable to improve adaptability, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The patent applies universality by designing the semiconductor chip with multi-functional pads that can serve different purposes based on the input signal. The same physical pads can be configured for different electrical connection relationships, providing adaptability without requiring separate dedicated structures for each function, thus limiting the increase in device complexity.
Data Source
AI summary
A semiconductor package includes: a plurality of transmission external terminals; a plurality of reception external terminals; a semiconductor chip including a plurality of transmission pads, a plurality of reception pads, and at least one option pad; a plurality of transmission lanes electrically connected between the plurality of transmission external terminals and the plurality of transmission pads; and a plurality of reception lanes electrically connected between the plurality of reception external terminals and the plurality of reception pads. The semiconductor chip is configured to swap signals or connections for the plurality of transmission pads, or swap signals or connections for the plurality of reception pads, selectively depending on an input of the at least one option pad.