Semiconductor Marking via Laser Through Adhesive Layer
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with markings are complex, costly, and prone to forming unclear markings due to the difficulty in laser irradiation on thin semiconductor substrates, which can damage the circuit and lead to cracking or excessive temperature issues.
Innovation Solution
A method involving a semiconductor wafer attached to a supporting sheet with an adhesive layer, where a laser is applied through the supporting sheet to create markings on the semiconductor device portions, using a YAG laser with a shorter wavelength to avoid damaging the substrate and forming clear, visible markings by carbonizing the adhesive layer to create a carbide marking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser irradiation is applied directly on thin semiconductor substrates to form markings, then markings can be formed, but the circuit may be damaged and cracking or excessive temperature issues occur
Solution Approach 1:
The patent introduces a transparent resin layer as an intermediary between the laser beam and the semiconductor substrate. This resin layer absorbs the laser energy and converts it to heat, which then marks the substrate indirectly through thermal diffusion, preventing direct laser damage to the circuit while still achieving clear markings
Solution Approach 2:
The transparent resin layer acts as a consumable sacrificial material that absorbs the harmful laser energy. This disposable layer protects the valuable semiconductor substrate from direct laser exposure, allowing the laser energy to be dissipated safely in the resin instead of damaging the substrate
2Manufacturing precision
If high laser output and long irradiation time are used to form clear markings, then clear markings are achieved, but excessive temperature and cracking occur
Solution Approach 1:
The transparent resin layer serves as a thermal buffer that controls heat distribution. It absorbs laser energy and converts it to controlled thermal diffusion, preventing excessive temperature spikes and cracking while still producing visible markings through the thermal process
Solution Approach 2:
The patent changes the physical state and thermal properties of the resin layer to optimize heat transfer. By selecting resin with specific thermal conductivity and heat capacity, the laser energy is converted to controlled thermal diffusion that produces clear markings without excessive temperature rise or substrate damage
3Manufacturing precision
If complex marking processes are used to ensure clear markings, then marking quality improves, but manufacturing cost and process complexity increase
Solution Approach 1:
The transparent resin layer is applied to the semiconductor substrate before the laser marking process. This preliminary preparation simplifies the subsequent laser marking step, as the resin layer is specifically designed to absorb laser energy efficiently, eliminating the need for complex multi-step marking processes
Solution Approach 2:
The patent optimizes the resin layer's optical and thermal parameters to maximize laser energy absorption and thermal diffusion efficiency. By tuning the resin's refractive index, absorption coefficient, and thermal conductivity, clear markings are achieved with simple, direct laser irradiation, reducing process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the marking process, reduces manufacturing costs, and ensures clear, visible markings on the semiconductor devices without damaging the substrate, while maintaining low laser output and irradiation time to prevent overheating.
Implementation Method 1
performing marking on a main surface of each of the semiconductor device portions included in the semiconductor wafer by causing a laser to pass through the supporting sheet and the adhesive layer and to be applied on the main surface
Implementation Method 2
forming clear, visible markings by carbonizing the adhesive layer to create a carbide marking
Data Source
AI summary
A method for manufacturing a semiconductor device is provided with: a step of preparing a semiconductor wafer (22) in a state where the circumference of the semiconductor wafer, which has been divided into semiconductor device parts, is adhered on a dicing sheet (21) supported by a wafer ring (23); a step of fixing the wafer ring (23) after transferring the wafer ring to a table (14) where laser printing is to be performed; and a step of marking on the main surface where the semiconductor material of the semiconductor device parts which configure the semiconductor wafer (22) is exposed, by radiating laser beams through the dicing sheet and an adhesive layer.