Semiconductor Laser Packaging With Post-Mount Beam Alignment
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Solution Overview
Problem
The challenge lies in efficiently mounting semiconductor lasers on a mounting substrate in a wafer or panel composite while addressing mounting tolerances and achieving precise alignment of laser diodes and optics, which is complex and costly with traditional methods.
Innovation Solution
A method involving the mounting of laser diodes on a substrate, followed by individual optical element placement to correct laser radiation, using encapsulation elements with optical surfaces created through material damage and removal to deflect and focus laser emission, allowing for simpler and faster production with reduced precision requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional precision alignment methods are used for mounting laser diodes and optics, then alignment precision is improved, but device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent applies preliminary action by pre-mounting all laser diodes on the substrate in a wafer-level process before any optical alignment is performed. This allows the mechanical mounting to be completed with relaxed tolerances, and the optical alignment to be achieved subsequently through individual optical element adjustment, thereby decoupling the mechanical assembly complexity from the optical alignment precision requirements.
Solution Approach 2:
The patent segments the alignment process into two independent stages: first, mechanical mounting of laser diodes on the substrate with relaxed tolerances; second, individual optical alignment of each laser diode's optical elements. This segmentation allows each stage to be optimized independently, reducing overall process complexity while maintaining final alignment precision.
2Manufacturing precision
If traditional individual mounting methods are used for laser diodes, then alignment precision is improved, but productivity decreases due to time-consuming processes
Solution Approach 1:
The patent performs preliminary wafer-level mounting of all laser diodes simultaneously on the substrate before individual optical alignment. This preliminary mechanical mounting can be done with standard, faster processes, and the subsequent optical alignment is performed individually but only for the optical elements, not the entire assembly, thereby maintaining precision while improving overall productivity.
Solution Approach 2:
The patent merges multiple laser diode mounting operations into a single wafer-level process, allowing simultaneous mounting of many diodes. This combining of operations dramatically increases productivity compared to individual mounting, while the final optical alignment precision is maintained through subsequent individual optical element adjustment.
3Productivity
If wafer-level mounting is used for laser diodes, then productivity is improved, but manufacturing precision deteriorates due to increased tolerances
Solution Approach 1:
The patent segments the precision requirements between mechanical mounting and optical alignment. The wafer-level mechanical mounting uses relaxed tolerances for high productivity, while the subsequent individual optical element alignment provides the necessary precision. This segmentation allows each sub-process to be optimized for its specific function.
Solution Approach 2:
The patent performs preliminary mechanical mounting at wafer level with relaxed tolerances to maximize productivity, then performs subsequent individual optical alignment to achieve the required precision. The preliminary action establishes the mechanical framework efficiently, while the follow-up action fine-tunes the optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables cost-effective and efficient production of semiconductor lasers by bypassing complex precision alignment, allowing for serial processing and quick optical measurements, and achieving precise radiation direction correction with minimal equipment and process complexity.
Implementation Method 1
optical surfaces for beam shaping are created for the laser diodes in the partial areas
Implementation Method 2
generating material damages in partial areas of the at least one encapsulation element
Data Source
AI summary
In one embodiment, the method serves for producing semiconductor lasers and includes the following steps in the order indicated: A) applying a multiplicity of edge emitting laser diodes on a mounting substrate, B) applying an encapsulation element, such that the laser diodes are applied in each case in a cavity between the mounting substrate and the associated encapsulation element, C) operating the laser diodes and determining emission directions of the laser diodes, D) producing material damage in partial regions of the encapsulation element, wherein the partial regions are uniquely assigned to the laser diodes, E) collectively removing material of the encapsulation element, said material being affected by the material damage, with the result that individual optical surfaces for beam shaping arise for the laser diodes in the partial regions, and F) singulating to form the semiconductor lasers.