Semiconductor Laser Component Bonding Layer Design
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Solution Overview
Problem
There is a need for a compact semiconductor laser component and a method to produce such components that are particularly compact and efficient in emitting laser radiation with reduced inductance and size.
Innovation Solution
A semiconductor laser component is designed with a semiconductor chip, an electrically insulating cladding that covers the chip in specific areas, and a bonding layer that electrically connects the chip to a connection point, eliminating the need for bond wires and using a photostructurable siloxane or other materials for the cladding, which provides mechanical and chemical protection while allowing for scalable and high-output power generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If bond wires are used to connect the semiconductor chip to connection points, then electrical connection is achieved, but the component size and inductance increase
Solution Approach 1:
The patent removes bond wires from the component structure entirely. Instead of using separate bond wires for electrical connection, the invention integrates the electrical connection function directly into the cladding structure through conductive paths embedded within the cladding material, thereby eliminating the need for additional connection elements and reducing overall component size and inductance.
Solution Approach 2:
The patent combines the electrical connection function with the cladding structure. The cladding serves dual purposes: providing mechanical protection and serving as the electrical connection medium through embedded conductive paths. This merging of functions eliminates the need for separate bond wires and reduces the number of discrete components.
2Strength
If the cladding covers the entire semiconductor chip including the first front surface, then mechanical protection is improved, but laser beam emission is blocked
Solution Approach 1:
The patent applies different properties to different regions of the cladding. The cladding material is made transparent or translucent specifically in the region corresponding to the first front surface to allow laser beam emission, while maintaining its protective and conductive properties in other regions. This localized modification of material properties enables simultaneous achievement of mechanical protection and optical transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, low-inductance semiconductor laser component suitable for generating short laser pulses, with reduced size and volume, and the ability to produce high output power, while being surface mountable and protected against mechanical and chemical damage.
Implementation Method 1
a bonding layer that electrically conductively connects the semiconductor chip to a first connection point
Implementation Method 2
provides mechanical and chemical protection
Implementation Method 3
provides mechanical and chemical protection
Data Source
AI summary
A semiconductor laser component including a semiconductor chip arranged to emit laser radiation, a cladding that is electrically insulating and covers the semiconductor chip in places, and a bonding layer that electrically conductively connects the semiconductor chip to a first connection point, wherein the semiconductor chip includes a cover surface, a bottom surface, a first front surface, a second front surface, a first side surface and a second side surface, the first front surface is arranged to decouple the laser beam, the cladding covers the semiconductor chip at least in places on the cover surface, the second front surface, the first side surface and the second side surface, and the bonding layer on the cladding extends from the cover surface to the first connection point.