Semiconductor Laser Cap with Ceramic and Metal Segmentation
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Solution Overview
Problem
Existing semiconductor light emitting devices face challenges in achieving stable optical characteristics and efficient heat dissipation performance.
Innovation Solution
A light emitting device configuration featuring a cap with a ceramic first member and a metal second member, where a wavelength converting member is disposed in a through-hole, allowing light to pass through and facilitating heat dissipation, with the metal member positioned closer to the semiconductor laser element to enhance contact and reflectance, and potentially using a multilayer structure and light transmissive fillers for improved adhesion and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a wavelength converting member is disposed in a through-hole of a cap body, then light conversion efficiency is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The cap body is divided into two separate members: a first cap member that defines the through-hole and a second cap member that provides heat dissipation. This segmentation allows the wavelength converting member to be disposed in the through-hole for efficient light conversion while the second cap member with higher thermal conductivity ensures effective heat dissipation from the semiconductor light emitting element.
Solution Approach 2:
The cap body uses a composite structure combining two different materials with distinct properties: the first cap member (which may be ceramic or other material) and the second cap member made of metal material with high thermal conductivity. This composite approach allows simultaneous optimization of light conversion efficiency and heat dissipation performance.
2Ease of manufacture
If the cap body is made of a single material, then manufacturing is simplified, but optical characteristics stability deteriorates
Solution Approach 1:
The cap body is segmented into two members with different materials, where the first cap member can be made of ceramic or other materials optimized for optical characteristics stability, while the second cap member is made of metal for heat dissipation. This segmentation resolves the contradiction by allowing each member to be optimized for its specific function.
Solution Approach 2:
The use of composite materials (first cap member and second cap member made of different materials) enables simultaneous achievement of optical characteristics stability and heat dissipation performance, overcoming the limitation of single-material construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration provides enhanced stability in optical characteristics and heat dissipation performance by efficiently managing light reflection and heat dissipation, allowing for the combination of blue or purple light with converted light to produce white light.
Implementation Method 1
a wavelength converting member (40) disposed in the through-hole (30a) to emit light which has a wavelength different from wavelength of light from the semiconductor laser element (10)
Implementation Method 2
a cap (30) including a first member (31) made of a ceramic and a second member (32) made of a metal material
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A light emitting device (100) includes a semiconductor laser element (10); a cap (30) defining a through-hole (30a) allowing light from the semiconductor laser element to pass therethrough; and a wavelength converting member (40) disposed in the through-hole defined in the cap, the wavelength converting member being configured to emit light that has a wavelength different from a wavelength of light from the semiconductor laser element. The cap includes a first member (31) made of a ceramic, and a second member (32) made of a metal material. The through-hole includes a first through-hole (31a) penetrating the first member, and a second through-hole (32a) penetrating the second member. The wavelength converting member is disposed on the second member.