Semiconductor Laser Mass Production via Carrier Disk Singulation
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Solution Overview
Problem
There is a need for an efficient method to produce a large number of compact semiconductor lasers, as existing methods do not effectively enable mass production of compact devices.
Innovation Solution
The method involves using a carrier disk with a top and bottom surface that are essentially parallel, applying semiconductor laser chips to the top surface, and then singulating the assembly using laser cutting or wafer sawing to create individual semiconductor lasers with a mounting block and a perpendicular mounting surface, utilizing non-metallic materials like silicon or aluminum nitride for precise separation and planar parallelism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a carrier disk is used to apply multiple semiconductor laser chips and then singulated, then productivity is improved by mass production, but manufacturing precision may deteriorate due to separation processes
Solution Approach 1:
The carrier disk is pre-formed with a precisely defined separation line before the chips are applied. This preliminary preparation ensures that when singulation occurs, the mounting surface achieves the required angular precision (within 0.5 degrees of perpendicular) without compromising the mass production advantage
Solution Approach 2:
The patent replaces traditional mechanical mounting surface creation with a separation process along a pre-defined line. This substitution allows the mounting surface to be formed with high precision through controlled separation rather than mechanical machining, maintaining accuracy while enabling batch processing
2Ease of operation
If the carrier disk is separated into individual mounting blocks, then the semiconductor lasers can be individually mounted and handled, but the complexity of the manufacturing process increases
Solution Approach 1:
The carrier disk is designed with a separation line that allows clean division into individual mounting blocks. Each block contains exactly one semiconductor laser chip, enabling individual handling and mounting while the segmentation process itself remains simple and integrated into the manufacturing flow
Solution Approach 2:
The carrier disk serves multiple functions: it acts as a mounting substrate for multiple chips, provides a separation guide for precise singulation, and becomes part of the final mounting block structure. This multi-functionality reduces the need for additional components and simplifies the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient production of a large number of compact semiconductor lasers with precise angles and high planar parallelism, enabling the manufacturing of identical devices on a single carrier disc, improving the production efficiency and quality of semiconductor lasers.
Implementation Method 1
The assembly is separated using a laser cutting process or wafer sawing
Implementation Method 2
the semiconductor laser chips are optically pumpable semiconductor laser chips. This means that when the semiconductor laser chips are in operation, they are optically pumped by an external or internal pump source, so that electromagnetic radiation is generated by the semiconductor laser chips
Data Source
Figure 1A~1C
Figure 1D
Figure 2A~2B
AI summary
A method for producing a plurality of semiconductor lasers (100) is described, comprising the following process steps: a) providing a carrier disk (30), b) producing an assembly (70) by depositing a plurality of semiconductor laser chips (4) onto a top surface (31) of the carrier disk (30), c) separating the assembly (70) into a plurality of semiconductor lasers (100), wherein - each semiconductor laser (100) comprises a mounting block (3) and at least one semiconductor laser chip (4), - each mounting block (3) has a mounting surface (13) that is substantially perpendicular to a top surface (12) of the mounting block (3) on which the semiconductor laser chip (4) is arranged, and - the mounting surface (13) is produced during the separation of the assembly.