Semiconductor Package Laser Structuring for Die Alignment

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Solution Overview

Problem

The existing connection technologies for semiconductor chips are time-consuming and expensive due to the difficulty in accurately connecting external contact elements to small contact pads, and the position of these pads can shift during packaging, affecting electrical connections.

Innovation Solution

A method that involves using a scanner to measure the locations of semiconductor dies on a carrier, communicating this information to a photolithographic stepper or laser assembly, and aligning it only once to form precise openings above the contact pads, enabling accurate electrical connections with higher throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional connection technologies are used to connect external contact elements to contact pads, then the electrical connection can be established, but the process is time-consuming and expensive due to the difficulty in accurately connecting to small contact pads

Engineering Contradiction:

Improveconnection speedVSAvoidconnection accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by measuring and recording the actual positions of contact pads before the connection process. The system captures die location information and uses it to pre-calculate and pre-position the locations of contact openings in the dielectric layer, so that when external contact elements are connected, they automatically align with the contact pads without requiring time-consuming manual adjustment or trial-and-error positioning

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary coordinate system and calculation process that maps the measured contact pad positions to the corresponding contact opening positions in the dielectric layer. This intermediary computational layer translates the physical measurements into actionable positioning data for the connection process, enabling accurate connections without direct manual intervention

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If contact pads are made small to reduce package size, then the package dimensions are reduced, but the difficulty and time required to accurately connect external contact elements increases

Engineering Contradiction:

Improvepackage sizeVSAvoidconnection speed

Core Design Contradiction:

Area of stationary objectVSProductivity

Solution Approach 1:

The patent replaces manual mechanical positioning and alignment methods with an automated optical measurement and computational positioning system. Instead of relying on mechanical alignment tools or manual adjustment, the system uses optical scanners to measure contact pad positions and computational algorithms to determine contact opening locations, enabling fast and accurate connections to small contact pads

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If chips are picked and placed during packaging, then the packaging process can be completed, but the position of contact pads can shift, negatively affecting electrical connections

Engineering Contradiction:

Improvepackaging throughputVSAvoidcontact pad position stability

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent implements feedback by measuring the actual positions of contact pads after chip placement using an optical scanner. The measured die location information is fed back into the system to recalculate and adjust the positions of contact openings in the dielectric layer, ensuring that even if contact pads have shifted during handling, the connections will still be accurately positioned

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent applies dynamics by making the contact opening positions adaptive rather than fixed. The system dynamically adjusts the calculated contact opening locations based on the measured actual positions of contact pads, allowing the connection process to accommodate position variations that occur during chip placement and handling

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves the accuracy and speed of forming electrical connections, reducing processing time and enhancing the electrical performance of semiconductor packages by compensating for die misalignment during the packaging process.

Implementation Method 1

laser structuring the dielectric layer with the laser assembly based on the die location information generated by the scanner

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS9165841B2System and process for fabricating semiconductor packages

Publication Date: 2015.10.20 TAHOE RES LTD

AI summary

A method of processing semiconductor chips includes measuring locations of semiconductor dies placed on a carrier with a scanner to generate die location information. The method includes applying a dielectric layer over the semiconductor dies and communicating the die location information to a laser assembly. The method includes aligning the laser assembly with the carrier and laser structuring the dielectric layer with the laser assembly based on the die location information generated by the scanner.