Semiconductor Package Laser Mark Metal Layer Design
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Solution Overview
Problem
The challenge is to create a semiconductor package with a laser mark that maintains visibility without damaging the package, as existing methods face difficulties in forming laser marks on thin semiconductor packages due to heat generation and low visibility issues.
Innovation Solution
A semiconductor package design incorporating a laser mark metal layer with sub-metal layers on the second redistribution level layer, allowing the laser mark to be formed inside this layer, reducing damage risk and enhancing visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a laser mark is formed directly on the semiconductor package surface, then the laser mark visibility is improved, but the semiconductor package may be damaged due to heat generation
Solution Approach 1:
The patent introduces a laser mark metal layer as an intermediary between the semiconductor package and the laser mark. This metal layer absorbs the laser energy and serves as a buffer, preventing direct heat transfer to the semiconductor package while enabling visible laser mark formation. The metal layer acts as a mediator that decouples the visibility requirement from the heat damage risk.
2Volume of moving object
If the semiconductor package is made thinner to reduce size, then the compactness is improved, but forming a laser mark without damage becomes more difficult
Solution Approach 1:
The patent applies preliminary action by forming the laser mark metal layer on the semiconductor package surface before attempting to create the laser mark. This pre-prepared metal layer ensures that when laser marking is performed, the energy absorption and heat distribution are already optimized, making the process feasible even on thin packages without risking damage during the marking operation.
3Illumination intensity
If the laser energy is increased to improve mark visibility, then the laser mark brightness is improved, but the damage risk to the semiconductor package increases
Solution Approach 1:
The patent changes the physical parameter of the package surface by adding a metal layer with different optical and thermal properties. This metal layer has high laser energy absorption capability and high thermal conductivity, which allows the system to use higher laser energy for visible marks while the metal layer manages the heat differently than the original package materials, thus reducing damage risk.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively forms a visible laser mark within the laser mark metal layer, preventing damage to the redistribution level layer and improving mark visibility, while allowing for precise control of the mark's depth and pattern.
Implementation Method 1
the laser mark metal layer arranged on the second redistribution level layer
Implementation Method 2
a laser mark arranged inside the laser mark metal layer
Data Source
AI summary
A semiconductor package includes: an encapsulation layer sealing at least one semiconductor chip; a redistribution level layer arranged on the encapsulation layer; a laser mark metal layer arranged on the redistribution level layer; and a laser mark arranged inside the laser mark metal layer. The laser mark includes letters, numbers, figures, symbols, and recognition codes indicating various pieces of information of the semiconductor package.