Semiconductor Laser Package With Metal Base for Thermal Conduction
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Solution Overview
Problem
Existing light emitting element packages, particularly those using ceramic materials, face inefficiencies in heat dissipation due to the thermal conductivity limitations of ceramic materials, which can lead to reduced performance and reliability of semiconductor laser elements.
Innovation Solution
A light emitting device design incorporating a base member with a metal bottom part for enhanced heat dissipation, featuring a ceramic frame part and a gap between the frame and bottom parts to improve thermal conductivity, along with a light reflecting member and electrode layers for efficient light emission and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a ceramic base member is used for the light emitting element package, then the structural integrity and chemical stability are improved, but the heat dissipation performance deteriorates due to the thermal conductivity limitations of ceramic materials
Solution Approach 1:
The base member is constructed as a composite structure combining a ceramic frame part (providing structural integrity and chemical stability) with a metal bottom part (providing high thermal conductivity for heat dissipation). This composite approach allows simultaneous achievement of mechanical reliability and thermal performance by integrating materials with complementary properties.
2Reliability
If a ceramic base member is used for the light emitting element package, then the chemical stability is improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The base member is constructed as a composite structure combining a ceramic frame part (providing structural integrity and chemical stability) with a metal bottom part (providing high thermal conductivity for heat dissipation). This composite approach allows simultaneous achievement of mechanical reliability and thermal performance by integrating materials with complementary properties.
3Temperature
If a metal bottom part is introduced to improve heat dissipation, then the thermal conductivity is improved, but the device complexity increases due to the multi-component base member structure
Solution Approach 1:
The base member is segmented into functionally distinct parts: a ceramic frame part for structural support and chemical stability, and a metal bottom part for heat dissipation. This segmentation allows each component to be optimized for its specific function while being manufactured and assembled separately, potentially simplifying the overall manufacturing process despite the multi-material nature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively enhances heat dissipation and light emission efficiency by utilizing a metal bottom part with higher thermal conductivity, improving the overall performance and reliability of the light emitting device.
Implementation Method 1
a base member including a bottom part having an arrangement surface on which the light reflecting member and the semiconductor laser element are arranged, and a frame part surrounding the arrangement surface and bonded to the bottom part
Implementation Method 2
a light reflecting member configured to reflect light emitted from the semiconductor laser element
Data Source
AI summary
A light emitting device includes a first semiconductor laser element, a light reflecting member, a base member, and a wire. The base member includes a frame part forming a frame. The frame part has a step portion inside of the frame, a bonding surface bonded to the bottom part, a first inner surface extending below the bonding surface, a second inner surface extending above the bonding surface, a first planar surface defining a planar surface of the step portion on an upper surface side, and a first electrode layer and a second electrode layer electrically connected to each other. The second electrode layer is disposed on the first planar surface. The wire is bonded to the second electrode layer and electrically connected to the first semiconductor laser element. A width of the bonding surface is greater on a first planar surface side than on an opposite side.