Semiconductor Chip Laser Resin Removal via Inversion
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Solution Overview
Problem
Conventional methods for manufacturing semiconductor devices require applying a laser to both plate surfaces of a semiconductor chip to remove resin, necessitating separate laser applications from each side, which is inefficient and increases manufacturing costs.
Innovation Solution
A method where a semiconductor chip made of a material with lower laser absorptivity than the resin is used, allowing a laser with a specific wavelength to pass through the chip and selectively sublimate the resin on one plate surface, which then removes the resin on the other surface when applied, enabling resin removal from both sides with a single laser application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the resin is removed by applying the laser from both plate surfaces separately, then the resin on both surfaces can be removed completely, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
Instead of applying the laser from both sides to remove resin, the invention applies the laser from only one side. The laser wavelength is selected to pass through the semiconductor chip material while being absorbed by the resin, enabling resin removal from the opposite side without direct laser contact. This inverts the conventional approach and resolves the contradiction by simplifying the process while maintaining complete resin removal.
Solution Approach 2:
The semiconductor chip material acts as an intermediary that allows the laser to pass through it while the resin absorbs the laser energy. By selecting a laser wavelength that has high transmittance through the chip material but high absorption by the resin, the resin on the far side can be removed without applying the laser from that side, thus simplifying the manufacturing process.
2Manufacturing precision
If the laser is applied from both plate surfaces, then all resin can be removed, but the manufacturing time and cost increase
Solution Approach 1:
The invention inverts the conventional laser removal approach by applying the laser from one side only. The key is selecting a laser wavelength that passes through the semiconductor chip material while being absorbed by the resin, allowing resin removal from the far side without direct laser application from that side, thereby doubling manufacturing efficiency.
Solution Approach 2:
The invention changes the laser wavelength parameter to achieve differential transmission and absorption. By selecting a wavelength that has high transmittance through the chip material but high absorption by the resin, the process enables single-sided laser application to remove resin from both sides, significantly improving productivity.
3Ease of manufacture
If a general mold is used to seal the entire semiconductor chip, then the mold cost is reduced, but the resin removal process becomes more difficult
Solution Approach 1:
The invention maintains the use of general molds for sealing the entire chip (keeping costs low) but inverts the resin removal approach. Instead of trying to access and remove resin from both sides mechanically or chemically, the laser is applied from one side only, utilizing the chip material's transparency to remove resin from the far side, thus avoiding process complexity while maintaining cost effectiveness.
Solution Approach 2:
The invention replaces complex mechanical or chemical resin removal processes with a laser-based approach. By selecting a laser wavelength that passes through the chip material and is absorbed by the resin, the resin can be removed via thermal ablation from a single side, substituting complex multi-step mechanical removal with a simpler optical process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient resin removal from both plate surfaces of a semiconductor chip with a single laser application from one side, reducing manufacturing complexity and costs while protecting the chip from damage.
Implementation Method 1
a laser is applied to the resin so that a part of the resin applied with the laser is sublimated and removed
Implementation Method 2
a laser having a wavelength that passes through the semiconductor chip and is less absorbed in the semiconductor chip than in the resin is applied
Data Source
AI summary
In a manufacturing method of a semiconductor device, a semiconductor chip is sealed with a resin, and then a laser is applied to remove the resin so that a part of the semiconductor chip is exposed. The semiconductor chip is made of a material that has a lower absorptivity of the laser than the resin and is not melted by the laser. The laser has a wavelength that passes through the semiconductor chip and has a lower absorptivity in the semiconductor chip than in the resin. The laser is applied to the resin from a side adjacent to one of plate surfaces of the semiconductor chip, so that the resin sealing the one of the plate surfaces is sublimated and removed and at least a part of the resin sealing the other of the plate surfaces is subsequently sublimated and removed by the laser having passed through the semiconductor chip.