Semiconductor Laser Element with Segmented Ridge for Thermal Stress Management
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Solution Overview
Problem
Existing semiconductor laser elements face challenges in high-temperature operations due to increased operating current and stress issues when fixed to a submount, leading to unreliable radiation and polarization characteristics.
Innovation Solution
The semiconductor laser element incorporates a stripe-shaped light-emitting region with a terrace section separated from the ridge portion by a grooved portion, where the top surface is covered with metal, and the terrace section is divided into scattered or lattice-like portions, enhancing heat dissipation and reducing stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor laser element is fixed to a submount with a solder layer, then heat dissipation is improved, but stress concentration and tilting occur due to the rigid ridge portion structure
Solution Approach 1:
The ridge portion is divided into multiple segments along the resonator direction by introducing grooved portions. This segmentation allows the ridge to flex and accommodate thermal expansion differences between the semiconductor laser element and the submount, reducing stress concentration and preventing tilting while maintaining effective heat dissipation pathways.
2Temperature
If the operating temperature is increased, then the laser can operate at higher temperatures, but the operating current increases leading to reduced reliability
Solution Approach 1:
By segmenting the ridge portion into multiple sections separated by grooved portions, the structure can better manage thermal stress distribution at high operating temperatures. This reduces the overall stress on the device while maintaining electrical continuity, allowing stable operation at elevated temperatures without excessive current increase.
3Ease of manufacture
If a continuous ridge portion is used, then the structure is simple and easy to manufacture, but stress is concentrated when fixed to the submount
Solution Approach 1:
The ridge portion is segmented by grooved portions that can be formed using standard photolithography and etching processes. This segmentation approach maintains manufacturing simplicity while effectively reducing stress concentration during submount bonding, as the grooves allow the structure to flex and distribute mechanical stresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency, allowing for higher operating temperatures and preventing tilting and stress-related issues, thereby stabilizing radiation and polarization characteristics.
Implementation Method 1
A top surface of a region including the grooved portion is covered by a metal, and the terrace section is divided into a plurality of portions that are disposed in a scattered manner... This design improves heat dissipation efficiency
Implementation Method 2
formed by adhering a surface of the semiconductor laser element on a side opposite to a semiconductor substrate and a submount to each other by a solder layer
Data Source
AI summary
A semiconductor laser element that includes a stripe-shaped light-emitting region and that is formed by adhering a surface of the semiconductor laser element on a side opposite to a semiconductor substrate and a submount to each other by a solder layer includes a terrace section on a surface of the semiconductor laser element that is adhered by the solder layer, the terrace section being separated from a ridge portion, which is a current-carrying portion, by a grooved portion. A top surface of a region including the grooved portion is covered by a metal. The terrace section is divided into a plurality of portions that are disposed in a scattered manner.