Compound Semiconductor Device Laser-Processed Side Surface
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Solution Overview
Problem
Current light emitting diodes (LEDs) face challenges in brightness enhancement and process yield improvement, particularly in the formation of semiconductor stacks on substrates, which can lead to cracks and damage during the manufacturing process.
Innovation Solution
A method involving a substrate with a patterned structure, including a semiconductor stack with specific deteriorated regions formed by laser processing, which creates a concave-convex surface structure to enhance light extraction and prevent damage during the breaking process, thereby improving the yield and brightness of light emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional LED manufacturing processes are used, then production can proceed with standard methods, but cracks and damage occur during the breaking process leading to reduced yield
Solution Approach 1:
The patent applies preliminary action by forming deteriorated regions in the substrate before the breaking process. These deteriorated regions are created through laser processing that modifies the substrate structure in advance, creating a concave-convex surface structure that prevents crack propagation during subsequent breaking operations, thereby improving both yield and reliability
Solution Approach 2:
The patent converts the harmful effect of laser processing (which can cause substrate damage) into a beneficial outcome. By carefully controlling laser parameters, the deteriorated regions created by laser processing actually improve crack resistance and yield by creating a structure that guides and prevents unwanted crack propagation during the breaking process
2Illumination intensity
If the substrate surface is kept smooth and intact, then manufacturing is simpler, but light extraction efficiency is reduced
Solution Approach 1:
The patent applies local quality by creating deteriorated regions with specific properties in localized areas of the substrate rather than uniformly across the entire surface. The laser processing creates distinct concave-convex structures in specific regions that enhance light extraction, while other regions maintain their original properties, thus improving light extraction without requiring complete substrate restructuring
Solution Approach 2:
The patent replaces conventional mechanical surface treatment methods with laser processing. Instead of using mechanical abrasion or chemical etching to create surface structures for light extraction, the invention uses laser energy to directly create the desired concave-convex surface morphology, simplifying the manufacturing process while achieving the optical enhancement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances light extraction and improves the reliability and yield of light emitting devices by forming a concave-convex surface structure that reduces the risk of cracks and damage during the manufacturing process, leading to increased output power and efficiency.
Implementation Method 1
a first deteriorated region 221 and a second deteriorated region 222 are formed on a side surface 200s of the wafer substrate 200
Data Source
AI summary
A compound semiconductor device includes a substrate, including a top surface, a bottom surface, a side surface connecting the top surface and the bottom surface; and a semiconductor stack formed on the top surface, wherein the side surface includes a first deteriorated surface, a second deteriorated surface, a first crack surface between the first and second deteriorated surfaces, a second crack surface between the first deteriorated surface and the top surface, and a third crack surface between the second deteriorated surface and the bottom surface, wherein the first crack surface is inclined to the first deteriorated surface or the second deteriorated surface; and wherein the second crack surface or the third crack surface is substantially perpendicular to the top surface or the bottom surface.