Semiconductor Laser Surface Mounting via Side Emission
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Solution Overview
Problem
Existing semiconductor laser devices are not designed for surface mounting, limiting their application in certain electronic devices.
Innovation Solution
A semiconductor laser device with a base material that includes a mounting face and an emission part, where the semiconductor laser element is mounted on the base material and light is emitted through the emission part, allowing for surface mounting by forming a conduction path through a wiring portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor laser device uses a conventional structure with leads sticking out from the base portion, then the device can be mounted on a circuit board through holes, but the device cannot be surface-mounted, limiting its application in certain electronic devices
Solution Approach 1:
The patent repositions the light emission direction from the vertical direction (through the base portion) to a horizontal direction (from the emission part on the base portion). This dimensional change allows the device to be surface-mounted on circuit boards, as the light emits sideways rather than requiring the device to be mounted vertically with leads passing through holes. The emission part is configured to emit light in a direction parallel to the mounting surface, enabling versatile mounting options.
2Adaptability or versatility
If the light emission direction is changed to enable surface mounting, then the device can be surface-mounted on circuit boards, but the mounting face and emission part configuration becomes more complex
Solution Approach 1:
The base material is divided into distinct functional regions: a mounting face for mounting the semiconductor laser element and a separate emission part for light emission. This segmentation allows the mounting face to be optimized for electrical connection and mechanical mounting, while the emission part is optimized for light emission. The emission part includes a light emitting section and a light transmitting section, further segmented to separate the laser element mounting area from the light emission area, enabling surface mounting capability.
Solution Approach 2:
The base material is configured with an asymmetric structure where the emission part is positioned at one end of the mounting face. This asymmetric configuration allows the light to emit from the side of the device rather than from the top or bottom, enabling surface mounting on circuit boards. The emission part extends in a direction parallel to the mounting surface, creating an asymmetric layout that facilitates surface mounting while maintaining efficient light emission.
3Use of energy by moving object
If the emission part is positioned at one end of the base material, then light can be emitted efficiently through the emission part, but the wiring portion must be configured to reach the semiconductor laser element from the mounting face
Solution Approach 1:
The base material acts as an intermediary structure that integrates both the mounting face for electrical connection and the emission part for light emission. The base material includes a light transmitting section that serves as a mediator between the semiconductor laser element and the external environment, allowing light to pass through efficiently. The wiring portion is configured on the mounting face to electrically connect to the semiconductor laser element, while the base material's light transmitting section facilitates optical connection, separating the electrical and optical pathways.
Data Source
AI summary
A semiconductor laser device includes a semiconductor laser element, a base material supporting the semiconductor laser element, and a wiring portion formed on the base material and constituting a conduction path to the semiconductor laser element. The base material includes a mounting face oriented to one side in a thickness direction of the base material and having the semiconductor laser element mounted thereon, while also including an emission part located on one side with respect to the semiconductor laser element in a first direction perpendicular to the thickness direction. Light from the semiconductor laser element is emitted through the emission part to the outside.