Semiconductor Laser Resonator Surfaces via Two-Stage Etching

The patent replaces the mechanical scribing and breaking process with a chemical etching process. The resonator surfaces are formed by etching recesses in the semiconductor layer sequence using chemical solutions, eliminating the need for mechanical contact and associated variations. This substitution enables consistent surface quality while significantly reducing manufacturing time and cost.

The patent performs the resonator surface formation by etching recesses before the singulation step. By preparing the resonator surfaces in advance on the full wafer or substrate, the process decouples surface quality from the subsequent breaking/singulation step. This preliminary action ensures that surface quality is determined by the controlled etching process rather than by mechanical breaking variations.

The patent replaces expensive mechanical scribing and breaking equipment and processes with chemical etching processes. The etching can be performed using standard semiconductor fabrication equipment, and the chemical solutions are relatively inexpensive. This substitution dramatically reduces capital equipment costs and per-unit manufacturing costs while maintaining or improving surface quality.

The chemical etching process is self-aligning and self-regulating to a degree. The etching chemistry naturally follows the pattern defined by the lithographic mask, and the process can be monitored and controlled through standard semiconductor manufacturing techniques. This reduces the need for expensive precision mechanical guidance systems and skilled manual operations.

The patent replaces mechanical scribing and breaking with chemical etching, which is inherently more consistent. Chemical etching processes are well-established in semiconductor manufacturing with tight process control capabilities. The etching rate and depth can be precisely controlled through chemistry formulation, temperature control, and timing, eliminating the random variations inherent in mechanical breaking processes.

The patent controls the etching process through multiple parameters including chemical solution composition, temperature, etching time, and mask pattern dimensions. By optimizing and controlling these parameters, the process achieves high consistency and repeatability. The etching depth and profile can be precisely tuned by adjusting these parameters, ensuring uniform resonator surfaces across wafers and production batches.