Semiconductor Package Lateral Connection Unit Design
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Solution Overview
Problem
Conventional Package-on-package (PoP) semiconductor structures are structurally weak due to increased overall height and susceptibility to cracking and bending under external impacts, as the sealing member may not cover the entire top surface of the lower package, concentrating external weight and leading to substrate damage.
Innovation Solution
A semiconductor package design featuring a first package with conductive pads on its top surface and a second package with conductive pads on its bottom surface, connected via a connection unit that extends along the side surfaces of both packages, eliminating the need for solder balls and ensuring electrical connection without increasing the overall height, and using a sealing member to cover the entire top surface of the lower package for enhanced structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the sealing member does not cover the entire top surface of the lower package, then the overall height is reduced, but the substrate becomes susceptible to cracking and bending under external impacts
Solution Approach 1:
The connection unit transitions from a vertical solder ball connection to a lateral wire-like structure that extends along the side surfaces of both packages. This dimensional change allows electrical connection without requiring the upper package to be supported by solder balls on the lower substrate, thereby reducing overall height while preventing substrate cracking and bending.
Solution Approach 2:
The invention extracts the electrical connection function from the solder balls on the substrate surface and relocates it to a separate connection unit that runs along the side surfaces. This separation allows the substrate to be fully covered by the sealing member for structural strength without compromising electrical connectivity.
2Reliability
If solder balls are used to electrically connect the upper package to the lower package, then electrical connectivity is achieved, but the substrate becomes structurally weak and prone to damage
Solution Approach 1:
The connection unit acts as an intermediary element that provides electrical connection between the upper and lower packages without requiring direct contact between solder balls and the lower substrate. This mediator approach maintains electrical connectivity while eliminating the structural weakness caused by solder ball-supported substrates.
Solution Approach 2:
The connection path is moved from a vertical dimension (solder balls on substrate surface) to a lateral dimension (wire-like structure along side surfaces), eliminating the need for substrate-supported electrical connections and thereby preserving substrate structural integrity.
3Strength
If the thickness of the lower package substrate is increased to prevent cracking and bending, then structural strength is improved, but the overall height of the package increases
Solution Approach 1:
By relocating the electrical connection path to lateral wire-like structures along the side surfaces, the invention eliminates the need for increased substrate thickness to support solder balls. This allows the substrate to maintain optimal thickness for structural strength while the overall package height is reduced.
Solution Approach 2:
The connection function is segmented from the substrate structure itself and placed in a separate connection unit. This segmentation allows the substrate to be optimized for structural strength without the constraint of supporting electrical connections, while the connection unit handles electrical connectivity independently.
Data Source
AI summary
Provided are a semiconductor device and a method of fabricating the same, and more particularly, a semiconductor package and a method of fabricating the semiconductor package. The semiconductor package includes a first package that comprises a first substrate, at least one first semiconductor chip stacked on the first substrate, and first conductive pads exposed on a top surface of the first substrate; a second package disposed below the first package such that the second package comprises a second substrate, at least one second semiconductor chip, and second conductive pads exposed on a bottom surface of the second substrate; and a connection unit that extends from the first conductive pads to the second conductive pads such that the connection unit covers a side surface of the first package and a side surface of the second package in order to electrically connect the first package to the second package.