Semiconductor Layer Structure for Conductor Adhesion Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Insufficient adhesion between the conductor layer and the semiconductor layer in semiconductor devices leads to peeling and poor conduction, affecting the quality and performance of the device.
Innovation Solution
The semiconductor layer is structured with a second portion having a larger surface area than the first portion, enhancing the anchoring effect of the conductor layer, which is connected to the second portion, thereby improving adhesion and resisting stress and expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional semiconductor layer structure is used, then the device structure is simple, but the adhesion between conductor layer and semiconductor layer is insufficient leading to peeling
Solution Approach 1:
The semiconductor layer is divided into a first portion and a second portion with different surface areas. The second portion has a larger surface area to provide enhanced adhesion for the conductor layer, while the first portion maintains the basic device structure. This segmentation allows different regions to serve different functional purposes.
Solution Approach 2:
The patent applies local quality by creating a second portion of the semiconductor layer with a larger surface area specifically at the region where the conductor layer is formed. This local enhancement of surface area provides improved adhesion and anchoring effect where needed, without complicating the entire device structure.
2Reliability
If the conductor layer is formed on a small surface area, then the device structure is simple, but the conductor layer peels due to insufficient anchoring effect
Solution Approach 1:
The second portion of the semiconductor layer is formed with a curved or domed surface having a larger surface area compared to the flat first portion. This curvature increases the surface area for conductor layer deposition, providing better anchoring effect and preventing peeling while maintaining structural integrity.
Solution Approach 2:
The patent transitions from a two-dimensional flat semiconductor layer to a three-dimensional structure by forming a second portion with increased surface area through curvature or doming. This dimensional change provides additional surface area for conductor layer adhesion without significantly increasing overall device footprint.
3Strength
If a larger surface area is provided for the conductor layer, then the adhesion is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The semiconductor layer is formed with a second portion having a larger surface area before the conductor layer is deposited. This preliminary structuring of the semiconductor layer ensures that when the conductor layer is subsequently formed, it automatically benefits from the enhanced surface area and anchoring effect without requiring additional complex manufacturing steps.
Solution Approach 2:
The patent merges the semiconductor layer formation process with the adhesion enhancement function by integrating the second portion with larger surface area directly into the semiconductor layer structure. This combination eliminates the need for separate adhesion-promoting structures or additional manufacturing processes.
Data Source
AI summary
A semiconductor device includes a substrate, a semiconductor layer, a conductor layer, and wiring. The semiconductor layer is provided on a surface side of the substrate and includes a first portion and a second portion with a larger surface area than the first portion. The conductor layer is provided on an opposite side of the second portion to the substrate. The wiring passes through the substrate and is connected to the conductor layer.