Semiconductor Layer Separation via Hydrogen Bond Cutting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current manufacturing methods for semiconductor and display devices face challenges in achieving low-cost, high-productivity, and high-yield processes, particularly in peeling methods that require large-sized substrates, low-temperature processing, and the production of flexible or curved display devices with low power consumption and high reliability.
Innovation Solution
A peeling method involving the formation of a metal oxide layer and a resin layer on a substrate, where the layers are separated by cutting hydrogen bonds using light irradiation, specifically employing laser light to reduce adhesion and facilitate separation, allowing for the use of large-sized substrates and low-temperature processing while maintaining high reliability and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser light irradiation is performed to peel the heat-resistant resin layer from the glass substrate, then the layer separation is achieved, but the manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive layer by incorporating specific organic compounds (carboxylic acids, alcohols, phenols) that create reversible bonding. This allows the bonding strength to be modulated through chemical rather than purely physical means, enabling easier separation without high-energy laser irradiation.
Solution Approach 2:
The patent introduces an adhesive layer as an intermediary between the heat-resistant resin layer and the glass substrate. This intermediate layer with controlled chemical composition facilitates separation through its inherent chemical properties rather than requiring external energy input, thus improving productivity while maintaining reliable layer separation.
2Reliability
If conventional peeling methods are used, then layer separation is achieved, but manufacturing cost increases
Solution Approach 1:
The adhesive layer is designed to provide self-service separation through its chemical composition. The organic compounds in the adhesive layer naturally facilitate detachment when conditions change (such as temperature variation or solvent exposure), eliminating the need for expensive external peeling equipment or processes.
Solution Approach 2:
By adjusting the chemical parameters of the adhesive layer (incorporating specific functional groups and molecular structures), the patent creates a layer that can be separated under mild conditions. This reduces manufacturing costs by eliminating the need for expensive laser equipment or complex mechanical peeling systems.
3Reliability
If high adhesion strength is used to ensure layer bonding, then bonding reliability is improved, but layer separation becomes difficult
Solution Approach 1:
The adhesive layer exhibits dynamic bonding characteristics - strong under normal conditions but capable of reversible detachment when triggered. The chemical composition allows the bonding strength to be modulated, providing strong adhesion during device operation while enabling controlled separation during manufacturing or recycling processes.
Solution Approach 2:
The adhesive layer uses a composite chemical composition combining multiple organic compounds (carboxylic acids, alcohols, phenols) that work synergistically to provide both strong bonding and easy separation. This composite approach allows the material to exhibit dual characteristics of strong adhesion and controllable detachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the efficient separation of layers with reduced adhesion, allowing for the production of flexible, curved, and reliable display devices with low power consumption, while also reducing manufacturing costs and improving productivity.
Implementation Method 1
The first material layer and the second material layer are separated from each other by cutting a hydrogen bond. The hydrogen bond is cut by light irradiation.
Data Source
AI summary
The yield of a manufacturing process of a semiconductor device is increased. The productivity of a semiconductor device is increased. A first material layer is formed over a substrate, a second material layer is formed over the first material layer, and the first material layer and the second material layer are separated from each other, so that a semiconductor device is manufactured. In addition, a stack including the first material layer and the second material layer is preferably heated before the separation. The first material layer includes one or more of hydrogen, oxygen, and water. The first material layer includes a metal oxide, for example. The second material layer includes a resin (e.g., polyimide or acrylic). The first material layer and the second material layer are separated from each other by cutting a hydrogen bond. The first material layer and the second material layer are separated from each other in such a manner that water separated out by heat treatment at an interface between the first material layer and the second material layer or in the vicinity of the interface is irradiated with light.