Semiconductor Circuit Layout Using 3D Conductive Member Isolation
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Solution Overview
Problem
Conventional semiconductor devices face challenges in miniaturization and preventing short-circuits due to the spatial arrangement of conductive members and semiconductor elements, which affects their operational efficiency and complexity.
Innovation Solution
The semiconductor device incorporates a unique configuration where the third conductive member's extending part, with a first portion between the first and second semiconductor elements, reduces the z-direction distance, allowing for miniaturization while preventing contact between conductive members, and features separately configured or integral fifth conductive members to connect the second semiconductor elements, thereby optimizing the layout and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the conductive members are arranged in a conventional spatial configuration, then the device structure is simpler, but the device size cannot be miniaturized and short-circuit risk increases
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional spatial configuration. The third conductive member extends in the thickness direction (z-direction) with its extending part positioned between semiconductor elements in the thickness direction, utilizing the third dimension to reduce device footprint while maintaining electrical isolation through spatial separation.
Solution Approach 2:
The third conductive member is divided into distinct functional parts: a terminal portion for external connection and an extending part for internal connection. This segmentation allows the extending part to be positioned optimally between semiconductor elements without interfering with element operation, while the terminal portion provides external access, thus miniaturizing the device while preventing short-circuits.
2Length of stationary object
If the third conductive member's extending part is positioned closer to reduce z-direction distance, then device miniaturization is achieved, but contact between conductive members may occur
Solution Approach 1:
The extending part of the third conductive member is positioned between the first and second semiconductor elements in the thickness direction (z-direction). By utilizing the third dimension (thickness direction) rather than extending in the planar directions, the patent achieves miniaturization while maintaining adequate spatial separation from other conductive members, thus reducing z-direction distance without causing contact.
3Reliability
If multiple conductive members are individually connected to semiconductor elements, then connection reliability is improved, but device complexity and interference increase
Solution Approach 1:
The third conductive member integrates multiple functions: it provides external electrical connection through its terminal portion and internally connects between semiconductor elements through its extending part. By merging the external connection function and internal inter-element connection function into a single conductive member, the patent reduces the number of separate conductive members needed, thereby simplifying device complexity while maintaining connection reliability.
Data Source
AI summary
A semiconductor device includes a first conductive member, a second conductive member spaced apart from the first conductive member in a first direction, a first semiconductor element bonded to the first conductive member, a second semiconductor element bonded to the second conductive member, a third conductive member, a fourth conductive member electrically connecting the first semiconductor element to the second conductive member, and a fifth conductive member electrically connecting the second semiconductor element to the third conductive member. The third conductive member includes a first portion located between the first semiconductor element and the second semiconductor element in the first direction, and the first portion faces the first conductive member in the thickness direction. One end of the fifth conductive member is bonded to the first portion. The fourth conductive member straddles the first portion.