Semiconductor Layout Optimization via Decoupling Capacitor Rearrangement
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Solution Overview
Problem
Current semiconductor device design methods face challenges in efficiently utilizing available white space, leading to suboptimal layouts and performance due to the complexity of integrating multiple elements and wiring layers.
Innovation Solution
A method and system for designing semiconductor device layouts that involve receiving input data, performing placement and routing, and specifically targeting decoupling capacitor cells within the layout to replace or modify them, thereby optimizing the use of white space by rearranging or modifying decoupling capacitor cells in targeted regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional placement and routing methods are used, then the basic layout is obtained, but the white space is not efficiently utilized leading to suboptimal decoupling capacitance
Solution Approach 1:
The patent performs placement and routing first to obtain an initial layout, then identifies target regions with insufficient decoupling capacitance before modifying the layout. This preliminary action allows the system to understand the baseline layout structure and wiring patterns before making targeted modifications to add decoupling capacitor cells, thereby efficiently utilizing white space without unnecessarily increasing overall layout complexity
Solution Approach 2:
The patent applies local quality by identifying specific target regions within the layout that have insufficient decoupling capacitance and modifying only those regions. Instead of redesigning the entire layout, the system selectively adds decoupling capacitor cells to specific areas where they are most needed, based on local wiring density and capacitance requirements, thus improving reliability without proportionally increasing device complexity
2Reliability
If the layout is optimized for decoupling capacitance by adding more capacitor cells, then the decoupling performance improves, but the layout complexity and design time increase
Solution Approach 1:
The patent evaluates specific target regions based on local wiring density and identifies only those areas that require additional decoupling capacitance. By applying modifications locally rather than globally, the system avoids unnecessary design time consumption while ensuring that decoupling capacitance is optimized only where needed, thus improving reliability without proportionally increasing design time
Solution Approach 2:
The patent changes parameters such as wiring density thresholds and decoupling capacitance requirements to automatically identify target regions. By using parameter-based criteria rather than manual inspection, the system efficiently determines where modifications are needed, reducing design time while maintaining optimized decoupling capacitance in critical regions
3Reliability
If decoupling capacitor cells are added to utilize white space, then the decoupling capacitance increases, but the leakage power may increase due to additional cells
Solution Approach 1:
The patent applies local quality by selectively adding decoupling capacitor cells only in target regions where wiring density indicates a need for additional capacitance. Rather than uniformly adding cells throughout the layout, the system identifies specific areas with high wiring density and insufficient decoupling capacitance, adding cells only where necessary. This targeted approach increases decoupling capacitance where needed while minimizing the total number of cells added, thereby reducing overall leakage power compared to a blanket approach
Data Source
AI summary
A method of designing a layout of a semiconductor device includes; receiving input data defining the semiconductor device, obtaining a first layout of the semiconductor device by performing a placement and routing in response to the input data, wherein the first layout includes a plurality of blocks, a plurality of standard cells, a plurality of decoupling capacitor cells, a plurality of filler cells, a plurality of power wirings, a plurality of ground wirings, a plurality of clock wirings, and a plurality of non-clock signal wirings, setting a target region on the first layout, wherein the target region includes a first decoupling capacitor cell among the plurality of decoupling capacitor cells, and obtaining a second layout of the semiconductor device by changing the first decoupling capacitor cell in the target region.


