Semiconductor Layout Design with Dummy Cell Spacing
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Solution Overview
Problem
The existing layout design methods for semiconductor devices are time-consuming and require significant trial and error, particularly when incorporating dummy cells, which increases design time and complicates the manufacturing process due to limitations in photolithography resolution.
Innovation Solution
The method involves arranging conductive lines for logic cells and dummy cells with specific reference distances based on photolithography resolution, using different photomasks for adjacent cells and the same photomask for dummy cells, and omitting additional swapping operations to reduce design time by spacing dummy cell conductive patterns apart, thus optimizing the layout design process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If dummy cells are inserted into the layout design, then the degree of integration and capacity of the semiconductor device are improved, but the layout design time increases significantly
Solution Approach 1:
The patent applies preliminary action by pre-defining standard cell layouts including dummy cells with predetermined conductive line configurations. The layout design tool automatically selects and places these pre-designed cells, eliminating the need for manual dummy cell insertion and subsequent swapping operations. This preliminary preparation of cell structures resolves the time loss contradiction by automating what would otherwise require extensive manual trial and error.
2Manufacturing precision
If conductive lines are arranged with different photomasks for adjacent logic cells, then the manufacturing precision is improved, but the device complexity and process steps increase
Solution Approach 1:
The patent applies local quality by differentiating photomask usage based on local requirements: adjacent logic cells use different photomasks for high-precision conductive lines, while dummy cells use the same photomask as their neighbors to reduce complexity. The layout design tool automatically determines which cells require different photomasks based on their functional importance and spatial relationships, optimizing the balance between precision and process simplicity.
3Measurement precision
If dummy cell conductive patterns are spaced farther apart, then the photolithography resolution requirements are relaxed, but the area occupied by dummy cells increases
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the spacing parameter of dummy cell conductive patterns based on the specific photolithography resolution capabilities of the manufacturing process. The layout design tool calculates optimal spacing distances that satisfy resolution requirements while minimizing area consumption. This parameter optimization resolves the contradiction by finding the minimum sufficient spacing rather than using fixed conservative values.
Data Source
AI summary
A method of manufacturing a semiconductor device includes configuring a layout pattern; and forming conductive lines corresponding to the layout pattern on a substrate, wherein configuring the layout pattern includes: arranging pre-conductive patterns and post-conductive patterns for a first logic cell, a second logic cell, and a third logic cell; rearranging the pre-conductive patterns and the post-conductive patterns so that two conductive patterns that are adjacent to a boundary between two adjacent logic cells from among the first logic cell, the second logic cell, and the third logic cell are formed by different photolithography processes; and arranging conductive patterns for a dummy cell arranged between the second logic cell and the third logic cell.