Semiconductor Layout Design Fin Spacing Adaptation
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Solution Overview
Problem
The existing methods for designing semiconductor device layouts are time-consuming and resource-intensive, particularly when adapting to new processes, leading to productivity disruptions and increased costs.
Innovation Solution
A method that allows for rapid layout changes by adjusting the spacing intervals of fin structures and source/drain regions within specific IC blocks, merging these changes with unchanged areas, and verifying the entire layout without updating design rule manuals or standard cell layouts, enabling quicker application of new processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If design changes are made to apply new processes to already designed semiconductor devices, then process compatibility is improved, but design time and resources increase significantly
Solution Approach 1:
The semiconductor device layout is divided into multiple IC blocks, allowing selective modification of individual blocks rather than redesigning the entire device. This segmentation enables targeted process adaptation while preserving other sections, significantly reducing overall design time and resources.
Solution Approach 2:
Different spacing intervals are applied to different IC blocks based on their specific process requirements. Fin structures in selected IC blocks are modified with new spacing intervals while other blocks maintain original spacing, allowing localized process optimization without global redesign.
2Adaptability or versatility
If fin structure spacing intervals are changed in IC blocks, then new process application is enabled, but layout verification complexity increases
Solution Approach 1:
The verification process is segmented to handle modified and unmodified IC blocks separately. By treating each IC block as an independent verification unit, the complexity of verifying the entire device is reduced to manageable portions, making verification more efficient despite the presence of modified spacing intervals.
3Reliability
If complete layout redesign is performed for new processes, then process optimization is achieved, but productivity decreases
Solution Approach 1:
Instead of performing complete layout redesign, only necessary IC blocks are modified with new spacing intervals. This partial action approach achieves sufficient process optimization for targeted blocks while avoiding the excessive time and resource investment required for full redesign, thereby maintaining productivity.
Solution Approach 2:
The layout modification methodology serves multiple functions: it enables new process application, maintains design productivity, and provides a scalable approach that can be applied to different IC blocks selectively. This multi-functional approach replaces the need for complete redesign while achieving process optimization goals.
Data Source
AI summary
A method of designing a layout of a semiconductor device includes determining from among a plurality of integrated circuit (IC) blocks in the semiconductor device a selection IC block for which a layout is to be changed, changing an spacing interval at which fin structures included in the selection IC block are spaced apart from each other in a first direction from a first spacing interval to a second spacing interval, and determining in the selection IC block locations of source/drain regions connected to the fin structures spaced apart from each other in the first direction at the second spacing interval.