Semiconductor Layout Design for Efficient Power Voltage Transfer
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Solution Overview
Problem
Existing semiconductor device layout designs face challenges in efficiently transferring power voltage to macros, which affects the overall performance and efficiency of the device.
Innovation Solution
A layout design method for floorplanning macros and bump cells in the center region of a semiconductor device, where macro bump cells are positioned based on the locations of macros, and safe areas are determined to optimize power voltage transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If macros are positioned in conventional layout designs, then device functionality is achieved, but power voltage transfer efficiency deteriorates due to suboptimal positioning
Solution Approach 1:
The patent applies preliminary action by performing floorplanning of macros and bump cells in the center region before detailed layout design. This advance positioning of power delivery components ensures optimal power voltage transfer paths are established early in the design process, preventing energy loss without complicating subsequent design steps.
Solution Approach 2:
The patent applies local quality by specifically targeting the center region of the semiconductor device for floorplanning macros and bump cells. This localized approach concentrates design effort where power voltage transfer is most critical, improving energy efficiency without requiring complete redesign of the entire device layout.
2Loss of energy
If floorplanning is performed without optimizing for power voltage transfer, then design process is simpler, but power voltage transfer efficiency deteriorates
Solution Approach 1:
The patent performs floorplanning of macros and bump cells in the center region as a preliminary step before detailed layout design. This advance planning establishes optimal power delivery configurations, minimizing voltage drops without making the subsequent manufacturing process more difficult.
Solution Approach 2:
The patent applies parameter changes by modifying the positional parameters of macros and bump cells during floorplanning to optimize power voltage transfer. By adjusting these parameters in the center region, the design achieves reduced voltage drop while maintaining ease of manufacture through systematic rather than ad-hoc modifications.
Data Source
AI summary
A semiconductor device according to an exemplary embodiment may include a first block that includes a first macro area where a plurality of first macros is positioned, a second block that includes a second macro area where a plurality of second macros is positioned, and a third block that includes a third macro area where a plurality of third macros is positioned, and the first macro area may be positioned adjacent to the second macro area and the third macro area in at least one direction of a first direction and a second direction perpendicular to the first direction.