Semiconductor Layout With Adjacent Wiring for Multi-Point Temperature Sensing
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Solution Overview
Problem
Existing semiconductor devices face challenges in layout flexibility due to uniform wirelength requirements, which constrain the disposition of semiconductor elements and wiring elements, and struggle to effectively monitor temperature distribution across multiple elements.
Innovation Solution
The semiconductor device incorporates wiring elements adjacent to semiconductor elements, with temperature sensors integrated into the wiring elements to face the semiconductor elements, allowing for flexible layout and precise temperature sensing without surrounding the wiring elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the wiring element is disposed in the center of the base plate and the semiconductor elements surround the wiring element, then the wirelength from each semiconductor element to the wiring element becomes uniform, but the layout flexibility is reduced
Solution Approach 1:
The patent divides the single central wiring element into multiple separate wiring elements, each disposed adjacent to individual semiconductor elements. This segmentation allows each wiring element to be independently positioned, enabling flexible layout arrangements while maintaining uniform wirelength characteristics through controlled placement rather than forced symmetry.
Solution Approach 2:
The patent transitions from a centralized radial layout (2D symmetry constraint) to a distributed linear arrangement along the base plate. By disposing wiring elements adjacent to semiconductor elements in a sequential manner rather than surrounding a central point, the design adds layout dimensionality and freedom, allowing optimization of both wirelength uniformity and layout flexibility simultaneously.
2Measurement precision
If temperature sensing elements are included in each semiconductor element, then the temperature of each semiconductor element can be sensed, but the effective area of the semiconductor elements is reduced
Solution Approach 1:
The patent extracts the temperature sensing function from the semiconductor elements and relocates it to separate wiring elements. By placing temperature sensors in the wiring elements adjacent to the semiconductor elements, the design maintains temperature monitoring capability while preserving the full effective area of semiconductor elements for their primary function.
Solution Approach 2:
The wiring elements serve as intermediary components that bridge the semiconductor elements and the temperature sensing function. Instead of embedding sensors directly in semiconductor elements, the wiring elements act as mediators that can sense temperature through thermal coupling with adjacent semiconductor elements, thereby decoupling the sensing function from the power handling function.
3Measurement precision
If one semiconductor element includes a temperature sensing element, then only the temperature of that one semiconductor element can be sensed, but the ability to sense temperature distribution across multiple elements is lost
Solution Approach 1:
The patent implements a universal temperature sensing architecture where multiple wiring elements, each containing temperature sensors, are disposed adjacent to multiple semiconductor elements. This multi-functional arrangement enables simultaneous temperature monitoring of all semiconductor elements, providing comprehensive temperature distribution data across the entire device while maintaining the same sensing mechanism throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances layout flexibility, improves temperature sensing precision, and maximizes the effective area of semiconductor elements by omitting temperature sensors from the elements, while reducing the risk of malfunctions and breaks.
Implementation Method 1
a temperature sensor that senses a temperature of an adjacent one of the semiconductor elements is disposed in each of the wiring elements
Data Source
AI summary
A semiconductor device includes: a base plate; semiconductor elements; and wiring elements disposed adjacent to the respective semiconductor elements on the base plate. A diode sensing a temperature of an adjacent one of the semiconductor elements is disposed in each of the wiring elements. The wire pad of each of the wiring elements is disposed to face the wire pad of the adjacent semiconductor element. The diode of each of the wiring elements is disposed closer to the adjacent semiconductor element. The wire pad of each of the semiconductor elements is connected through a wire to the wire pad of the wiring element adjacent to the semiconductor element.