Semiconductor Package Lead Structure for Crowded Die Pad Bonding
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Solution Overview
Problem
Conventional semiconductor devices face challenges in establishing electrical connections between semiconductor elements and die pads due to limited space on the die pad surface, where the area for bonding wires is narrow and densely occupied by other components.
Innovation Solution
The semiconductor device employs support portions and wires to establish electrical conductivity between the semiconductor element and the die pad, allowing for connections even when the die pad lacks sufficient space for direct bonding wires, using wires and metal layers to facilitate electrical paths through support portions and lead terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding wires are directly connected to the die pad, then electrical conductivity is achieved, but the die pad area becomes insufficient due to dense component occupation
Solution Approach 1:
The patent introduces support portions that extend vertically from the die pad surface, creating a three-dimensional electrical connection path. Instead of requiring all connections on the two-dimensional die pad surface, the wires are bonded to these elevated support portions, effectively utilizing the vertical dimension to resolve the area constraint.
Solution Approach 2:
The support portions act as intermediary structures between the die pad and the bonding wires. These metal support portions provide additional bonding surfaces that are spatially separated from the crowded die pad area, allowing wires to connect to the electrical system without competing for limited die pad surface space.
2Reliability
If support portions are introduced to provide additional bonding surfaces, then bonding reliability improves, but device complexity increases
Solution Approach 1:
The support portions are integrated with the existing die pad structure, forming a unified electrical connection system. The support portions extend from the die pad and are electrically connected to it, combining the functions of structural support and electrical conduction into a single integrated component rather than adding separate independent elements.
Data Source
AI summary
A semiconductor device includes a semiconductor element, a first lead, a sealing resin, and a first connecting member. The first lead includes a die pad portion that includes a die-pad obverse surface facing a first side in a thickness direction, and a support portion supporting the die pad portion. The semiconductor element is mounted on the die-pad obverse surface. The sealing resin covers the semiconductor element. The first connecting member is electrically connected to the support portion and electrically conductive to the semiconductor element. The support portion includes a connecting surface to which the first connecting member is electrically connected. The connecting surface and the die-pad obverse surface are different in position in the thickness direction.