Semiconductor Lead Cutouts for Creepage Insulation
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Solution Overview
Problem
Conventional semiconductor devices require a concave structure to ensure creepage distance, which complicates the package design and manufacturing process, and poses challenges for further downsizing and increased current and voltage requirements.
Innovation Solution
The semiconductor device features leads with cutouts filled with resin material, eliminating the need for a concave structure by integrating resin-filled portions directly into the package, ensuring creepage distance without complex mold structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a concave structure is formed in the package to ensure creepage distance, then electrical insulation between external terminals is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The invention extracts the creepage distance ensuring function from the package structure and relocates it to the lead structure. By forming cutouts in the leads themselves, the patent separates the insulation function from the package body, thereby simplifying the package structure while maintaining electrical insulation between external terminals.
Solution Approach 2:
Instead of modifying the package structure to create concave portions for creepage distance, the invention inverts the approach by modifying the lead structure with cutouts. This reversal of the conventional design approach transfers the complexity from the package to the leads, achieving insulation without complex package molding.
2Reliability
If a concave structure is formed in the package to ensure creepage distance, then electrical insulation between external terminals is improved, but manufacturing complexity increases
Solution Approach 1:
The invention extracts the creepage distance ensuring function from the package structure and relocates it to the lead structure. By forming cutouts in the leads themselves, the patent separates the insulation function from the package body, thereby simplifying the package structure while maintaining electrical insulation between external terminals.
Solution Approach 2:
The cutouts in the leads are formed in advance before the encapsulation process. This preliminary preparation of the lead structure with cutouts allows the resin to naturally fill these spaces during molding, ensuring creepage distance without requiring complex mold structures or post-processing steps.
3Ease of manufacture
If the package structure is simplified without concave portions, then manufacturing complexity is reduced, but creepage distance may be compromised
Solution Approach 1:
The resin material acts as an intermediary that fills the cutouts in the leads, creating the necessary creepage distance. This resin intermediary provides the electrical insulation function that would otherwise require complex concave structures in the package, thereby maintaining reliability while simplifying manufacturing.
Solution Approach 2:
The invention utilizes the composite structure of lead material and resin material to achieve creepage distance. The combination of the solid lead with cutouts and the resin filling these cutouts creates an effective insulation barrier, demonstrating how composite material arrangements can replace complex geometric structures.
Data Source
AI summary
A semiconductor device includes: leads (5) in each of which a cutout (5a) is formed; a die pad (11); a power element (1) held on the die pad (11); and a package (6) made of a resin material, and configured to encapsulate inner end portions of the leads (5), and the die pad (11) including the power element (1). The cutout (5a) is located in a region of each of the leads (5) including a portion of the lead (5) located at a boundary between the lead (5) and the package (6), and is filled with a resin material.