Semiconductor Lead With Varying Dielectric Thickness
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Solution Overview
Problem
Existing semiconductor package leads are not optimized for specific electrical characteristics, such as signal phase transmission properties, induction, and capacitance, which can lead to performance detriments at increasing frequencies.
Innovation Solution
The die package features leads with a metal core coated by a dielectric layer of varying thickness and an outer metal layer, allowing for selective modification of electrical properties through patterning and metallization, enabling adjustments in capacitance and inductance to optimize signal phase matching and impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonds are used to connect die to substrate, then the package can be manufactured with standard processes, but the leads are not optimized for specific electrical characteristics such as signal phase transmission, induction, and capacitance
Solution Approach 1:
The patent applies local quality by varying the dielectric layer thickness along the length of the lead. Specifically, the dielectric layer has a first thickness in a first section and a second thickness in a second section, allowing different electrical characteristics (capacitance, inductance) at different locations of the same lead structure. This enables optimization of signal phase transmission and impedance matching without changing the overall lead geometry or material composition.
2Reliability
If leads are designed with fixed geometry and material composition, then manufacturing is simplified, but electrical characteristics such as capacitance and inductance cannot be optimized for high frequency signal transmission
Solution Approach 1:
The patent implements parameter changes by modifying the dielectric layer thickness parameter along the lead length. The dielectric layer transitions from a first thickness to a second thickness, creating variations in electrical characteristics (capacitance, inductance) that optimize signal phase transmission. This approach maintains the basic lead structure while achieving electrical optimization through parameter variation rather than structural redesign.
3Reliability
If uniform dielectric coating is applied to all leads, then manufacturing process is simplified, but signal phase matching between different leads cannot be achieved
Solution Approach 1:
The patent applies local quality by creating non-uniform dielectric layer thickness along the lead length. The dielectric layer has different thicknesses in different sections, which allows selective modification of electrical characteristics for signal phase matching. This localized variation in dielectric thickness enables precise control over capacitance and inductance to achieve signal phase matching while maintaining a relatively simple conformal coating process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively matches signal phase and impedance across leads, reducing performance detriments at high frequencies by allowing precise control over electrical characteristics, thereby enhancing the reliability and efficiency of signal transmission.
Implementation Method 1
the dielectric layer having a first dielectric thickness that varies along its length... selectively modifying the electrical characteristics of the lead. In particular, EM perturbations can be created allowing for modifications of the electrical response as a function of frequency in terms of attenuation and/or phase
Implementation Method 2
optimized for particular electrical (in particular capacitive and/or inductive) characteristics... modifications of the electrical response as a function of frequency in terms of attenuation and/or phase
Data Source
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AI summary
The present invention relates to a die package comprising a die having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core (10) with a first core diameter, and a dielectric layer (20,30) surrounding the first metal core (S1), the dielectric layer (20,30) having a first dielectric thickness that varies along its length and/ or the dielectric layer having an outer metal layer (40, S4) at least partially surrounding the dielectric layer (20,30), for selectively modifying the electrical characteristics of the lead