Semiconductor Lead Frame Layout for Shorter Bond Wires
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices for motor drive control have a long wire length due to aligned leads and IC configuration, leading to increased costs and reduced efficiency in motor drive control.
Innovation Solution
The semiconductor device incorporates a lead frame configuration with island and band-shaped portions to reduce wire length, using multiple ICs and optimized lead arrangements to enhance efficiency and reduce noise interference, while the sealing resin supports the structure and prevents tilting during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the leads and IC are aligned in a single direction, then the device structure is simple, but the total wire length becomes relatively long
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement of leads and IC to a two-dimensional planar configuration. The leads are arranged in multiple directions around the IC, with some leads extending in opposite directions and at different angles. This dimensional change allows wires to connect over shorter distances while maintaining structural simplicity, directly resolving the contradiction between structural simplicity and wire length.
2Device complexity
If a single IC is used to drive and control the switching elements, then the device complexity is reduced, but the motor drive control efficiency is lowered
Solution Approach 1:
The patent divides the control function into multiple independent ICs, each responsible for driving and controlling specific switching elements. This segmentation allows each IC to handle simpler control tasks with more specialized reference signals, improving overall motor drive control efficiency. The multiple ICs work in parallel, maintaining device functionality while enhancing performance through functional division.
3Ease of manufacture
If the leads are aligned in a single direction, then the manufacturing process is simplified, but noise interference increases
Solution Approach 1:
The patent employs asymmetric lead arrangement where leads are positioned at different angles and directions rather than being uniformly aligned. This asymmetric configuration spatially separates signal paths, reducing electromagnetic interference and noise between adjacent leads. The asymmetric layout maintains manufacturing feasibility while effectively mitigating noise interference through increased spatial separation of electrical pathways.
Data Source
AI summary
A semiconductor device includes: an IC; a first lead having an island portion to which the IC is bonded; a second lead having a band-shaped portion; a plurality of additional leads spaced apart from the second lead with the first lead therebetween, and electrically connected to the IC; and a plurality of wires bonded to the IC and the plurality of additional leads. As viewed in the thickness direction, each of the additional leads has an edge facing the island portion. As viewed in the thickness direction, the band-shaped portion has a pair of elongated edges. As viewed in the thickness direction, the edge of the additional lead located closest to the band-shaped portion is positioned between the pair of elongated edges in a predetermined direction perpendicular to the thickness direction.