Semiconductor Device Lead Frame Integration for Temperature Detection
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Solution Overview
Problem
The existing semiconductor devices require additional space for temperature transducers and external connection terminals, increasing manufacturing costs and limiting miniaturization and temperature detection accuracy.
Innovation Solution
A semiconductor device design that integrates a temperature transducer with lead frames molded within a case, allowing for reduced space requirements and direct bonding to the laminated substrate, eliminating the need for external connections and enabling miniaturization without compromising temperature detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature transducer is disposed over the laminated substrate with separate external connection terminals, then the temperature detection function is achieved, but the device area and manufacturing costs increase
Solution Approach 1:
The patent merges the temperature transducer and external connection terminal into a single integrated lead frame structure. The lead frame serves dual functions: as an external connection terminal for electrical connections and as a mounting substrate for the temperature transducer. This integration eliminates the need for separate disposal areas for both components, thereby reducing the overall device area while maintaining temperature detection functionality.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: it acts as an external connection terminal for electrical connectivity, provides mechanical support, and serves as a mounting platform for the temperature transducer. By making the lead frame multi-functional, the patent eliminates the need for additional dedicated components and areas for temperature sensing, thus reducing device area without compromising detection capability.
2Measurement precision
If a temperature transducer is disposed over the laminated substrate with external connection terminals, then temperature monitoring is enabled, but manufacturing costs increase
Solution Approach 1:
The patent combines the temperature transducer and external connection terminal into a single integrated lead frame structure. This merging reduces the total component count and eliminates the need for separate mounting and connection processes, thereby simplifying the manufacturing process and reducing production costs while maintaining temperature monitoring functionality.
Solution Approach 2:
The lead frame is designed to perform multiple functions including electrical connection, mechanical support, and temperature sensing mounting. This multi-functionality reduces the number of separate components needed, simplifies assembly processes, and lowers manufacturing costs while ensuring temperature monitoring capability is achieved.
3Measurement precision
If the temperature transducer is placed closer to the semiconductor element for better detection accuracy, then temperature monitoring precision improves, but the available space for other components decreases
Solution Approach 1:
The patent integrates the temperature transducer mounting function directly into the lead frame structure that is already positioned near the semiconductor element for electrical connections. This integration allows the temperature transducer to be placed close to the semiconductor element for accurate temperature detection without requiring additional space, as the lead frame already occupies the necessary proximity location.
Solution Approach 2:
The lead frame serves multiple purposes including electrical connection and providing a mounting platform for the temperature transducer near the semiconductor element. This multi-functionality enables close placement of the temperature transducer for high detection accuracy while utilizing the existing space allocated for the lead frame, thus not encroaching on additional component space.
Data Source
AI summary
A semiconductor device includes a lead frame. One end portion of the lead frame is disposed outside a case, the other end portion of the lead frame is disposed over a front surface of an insulating board inside the case and near a semiconductor element, and the lead frame is formed in the case. Furthermore, the semiconductor device includes a temperature transducer disposed on a side of the other end portion of the lead frame opposite a laminated substrate and near a side portion of a semiconductor element. As a result, the temperature transducer is disposed near the side portion of the semiconductor element in the semiconductor device. Therefore, the temperature of the semiconductor element is properly detected. In addition, the length in the vertical direction of the case of the semiconductor device is reduced and miniaturization is realized.