Semiconductor Device Lead Frame Layout for Motor Control
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Solution Overview
Problem
Existing semiconductor devices for controlling motor operations, such as brushless DC motors, are limited by their elongated shape due to the alignment of switching elements, which restricts size reduction.
Innovation Solution
The semiconductor device incorporates a unique lead configuration with belt-like sections and a mounting base, allowing for a reduced size by overlapping the mounting base with the belt-like sections and using a sealing resin to cover the leads and switching elements, thereby optimizing the layout and minimizing the device's dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If switching elements are aligned in one direction, then electrical connection is simplified, but device size increases due to elongated shape
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement of switching elements to a two-dimensional planar layout. The lead frame is configured with a mounting base and multiple leads extending in different directions, allowing switching elements to be arranged in a plane rather than a line. This dimensional change enables more compact packaging while maintaining electrical connection simplicity.
Solution Approach 2:
The patent merges the mounting base with the lead frame structure, where the mounting base serves as both a mechanical support and an electrical connection point. Multiple leads are integrated into a single lead frame component, reducing the number of separate parts and simplifying the overall assembly process.
2Reliability
If multiple leads are arranged separately, then electrical connection is reliable, but device size increases
Solution Approach 1:
The patent implements a nested arrangement where smaller leads are positioned within the spatial envelope of larger leads. The first, second, third, and fourth leads are configured to overlap or interleave with each other in the planar view, creating a compact nested structure that maintains electrical isolation while minimizing overall device footprint.
Solution Approach 2:
Different regions of the lead frame are assigned different functional qualities. The mounting base area is optimized for IC mounting, while specific lead regions are configured for electrical connections to different switching elements. This local optimization allows each region to perform its function efficiently without requiring uniform spacing throughout the entire device.
Data Source
AI summary
A semiconductor device includes a first lead having a base extending in a first direction, and an IC on the base. The semiconductor device also includes a second lead, a third lead and fourth leads. The second lead includes a first belt-like section on one side of the base in the first direction, extending in a second direction, and paired second belt-like sections extending in the first direction from the first belt-like section. The third lead is on one side in the first direction. The fourth leads are on one side of the third lead in the first direction. First switching elements are bonded to the third lead. Second switching elements are respectively bonded to the fourth leads. The base overlaps with the first belt-like section 121 when viewed in the first direction. At least a part of the base is between the second belt-like sections.