Semiconductor Package Lead Structure for Heat Dissipation and Insulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices face challenges in efficient heat dissipation and mounting strength due to limitations in terminal configuration and sealing resin design, which affect their performance and reliability when attached to circuit boards and heat sinks.
Innovation Solution
The semiconductor device incorporates a conductive member with specifically designed leads and a sealing resin configuration that exposes the first lead reverse surface, allowing for enhanced heat dissipation and improved mounting strength by spreading heat over a wider area and increasing the creepage distance, thereby reducing the risk of force transmission from heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing resin covers the entire lead structure, then the insulation is improved, but the heat dissipation area is reduced
Solution Approach 1:
The sealing resin is configured to cover only specific portions of the lead structure rather than the entire surface. Specifically, it covers the pad obverse surface and certain exposed surfaces, while deliberately leaving the pad reverse surface exposed for heat dissipation. This localized sealing approach maintains insulation where needed while preserving thermal pathways where required.
2Reliability
If the pad reverse surface is covered by sealing resin, then the insulation is improved, but the mounting strength to heat sink is reduced
Solution Approach 1:
The sealing resin is selectively applied to cover the pad obverse surface and surrounding areas, while the pad reverse surface is deliberately left exposed. This creates a local distinction where insulation is provided on the obverse side while thermal contact is maintained on the reverse side for mounting to heat sinks.
Solution Approach 2:
An insulating sheet is introduced as an intermediary component placed between the pad reverse surface and the heat sink. This mediator provides the necessary electrical insulation while allowing thermal contact to be maintained, thus resolving the conflict between insulation requirements and heat dissipation needs.
3Strength
If the terminal portions extend further, then the mounting strength is improved, but the device complexity increases
Solution Approach 1:
The terminal portions are designed to serve multiple functions: they provide electrical connections, mechanical mounting support, and structural anchoring within the sealing resin. By making the terminals multi-functional, the design achieves improved mounting strength without adding separate dedicated mounting components, thus avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency and increases the mounting strength of the semiconductor device, reducing the risk of damage from applied forces and improving overall performance.
Implementation Method 1
a sealing resin covering the semiconductor element and a part of the die pad portion
Implementation Method 2
the first lead reverse surface is exposed from the second resin surface... allowing for enhanced heat dissipation
Data Source
AI summary
A semiconductor device includes an element of semiconductor, first/second leads and a sealing resin. The first lead includes a die pad and a first terminal. The die pad includes a first lead obverse surface facing one side in thickness direction for mounting the element and a first lead reverse surface facing the other side in thickness direction. The sealing resin includes first/second resin surfaces respectively facing the one side and the other side in thickness direction. The sealing resin covers the element and a part of the die pad. The first lead reverse surface is exposed from the second resin surface. The second lead includes a second pad conducting to the element and a second terminal connected to the second pad. The second terminal includes a fourth portion connected to the second pad and a fifth portion on the one side in the thickness direction relative to the fourth portion.