Semiconductor Lead Portion Inclined Surface for Miniaturization
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Solution Overview
Problem
Existing semiconductor devices face challenges in miniaturization due to increased size caused by predetermined spaces between lead portions and frame bodies, making it difficult to meet demands for smaller form factors.
Innovation Solution
The semiconductor device incorporates lead portions with inclined or dogleg end surfaces that intersect the frame body's end surface, forming movement restriction portions to suppress vibration during ultrasonic bonding, allowing the lead portions to be positioned closer to the frame body and reducing overall structure size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a predetermined space is formed between the lead portion and the frame body, then the lead portion can be positioned for bonding, but the overall device size increases
Solution Approach 1:
The lead portion is designed with an inclined surface that changes the spatial relationship between the lead portion and frame body from a parallel gap configuration to an angled intersection configuration. This dimensional change allows the lead portion to approach the frame body end surface more closely while maintaining bonding capability, thereby reducing the overall device area without sacrificing manufacturing ease.
Solution Approach 2:
The lead portion features an asymmetric inclined surface rather than a symmetric parallel configuration. This asymmetry allows one side of the lead portion to intersect the frame body end surface at an angle, enabling closer positioning and reduced device area while still providing adequate space for bonding operations on the bonding surface.
2Area of stationary object
If the lead portion is positioned closer to the frame body, then device size is reduced, but vibration during ultrasonic bonding increases
Solution Approach 1:
The inclined surface of the lead portion, which initially appears to be merely a geometric feature for size reduction, actually serves to convert the harmful vibration during ultrasonic bonding into a beneficial stabilizing effect. The angled configuration provides mechanical stability that suppresses excessive vibration, transforming what would be a harmful factor into an advantage for achieving both miniaturization and stable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables accurate ultrasonic bonding while minimizing the size of the semiconductor device by reducing the gap between lead portions and the frame body, effectively addressing the miniaturization challenge.
Implementation Method 1
the inclined portion extends in a direction in which a vibration component is suppressed during the ultrasonic bonding of the bonding wire
Implementation Method 2
a bonding wire connects the lead portion to the semiconductor chip... during the ultrasonic bonding of the bonding wire
Data Source
Figure 1~2
Figure 3~4
Figure 5(a)~5(d)
AI summary
A semiconductor device which can be miniaturized is provided. The semiconductor device includes a frame body (3) having an opening region (2) formed in a central portion, an insulating substrate (4) which is provided in the opening region of the frame body and on which semiconductor chips (8) and (9) are mounted, lead portions (5a) to (5e), each including an inclined portion that is at least partially exposed to the opening region formed in the frame body and extends so as to be inclined with respect to an end surface forming the opening region, and a bonding wire (10) that is bonded between the lead portion and the semiconductor chip by ultrasonic bonding.