Semiconductor Lead Layout to Prevent Resin-End Terminal Shorting
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Solution Overview
Problem
Semiconductor devices with switching elements, such as MOSFETs, used in electric vehicles and hybrid vehicles face shorting issues due to aligned drain and source terminals exposed from the same end of the sealing resin, leading to potential damage of downstream components.
Innovation Solution
A semiconductor device design where the first lead is exposed from one end portion of the resin reverse surface and the second lead is exposed from an opposite end portion, preventing them from being exposed from the same end, thus reducing the likelihood of shorting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the drain terminal and source terminal are aligned side by side at the same end of the reverse surface of the sealing resin, then the device structure is simplified and manufacturing is easier, but shorting may occur between the terminals leading to system failure
Solution Approach 1:
The patent transitions from a two-dimensional arrangement where both terminals are exposed at the same end to a three-dimensional configuration where terminals are distributed across multiple ends of the sealing resin. This spatial redistribution in additional dimensions prevents shorting while maintaining manufacturing simplicity.
Solution Approach 2:
The patent segments the terminal exposure locations across different ends of the sealing resin rather than concentrating them at one location. This segmentation separates the drain and source terminals in space, eliminating the shorting risk while preserving the simplified manufacturing process.
2Power
If large current of no less than 10 A is inputted to the semiconductor device, then the device can handle high power applications, but shorting will cause large current to flow directly damaging downstream components
Solution Approach 1:
The sealing resin acts as an intermediary barrier that physically separates the drain and source terminals. This intermediary prevents direct contact and shorting, allowing the device to safely handle high currents up to 10 A or more without damaging downstream components.
Data Source
AI summary
A semiconductor device includes a semiconductor switching element, a first lead with the semiconductor element mounted thereon, a second lead, and a sealing resin. The second lead is spaced from the first lead in a first direction perpendicular to a thickness direction of the semiconductor element. The sealing resin covers a portion of the first lead, a portion of the second lead, and the semiconductor element. A resin reverse surface of the sealing resin includes a first and a second end portions spaced from each other in the first direction. The resin reverse surface also includes a third and a fourth end portions spaced from each other in a second direction perpendicular to the thickness direction and the first direction. Among the four end portions, the first lead is exposed only from the first end portion, and the second lead is exposed only from the second end portion.