Semiconductor Package Lead Protrusion Structure for Compact Coupling
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Solution Overview
Problem
Existing semiconductor packages face issues such as excess cost, decreased reliability, relatively low performance, and large package sizes, which are not adequately addressed by conventional methods.
Innovation Solution
The proposed solution involves a semiconductor device design with a substrate having a lead with a via and a protrusion, where the substrate encapsulant covers the via's lateral sides but not the protrusion's, allowing the protrusion to protrude and enhance electrical coupling. Additionally, a redistribution structure and lead trace are used to route electrical signals effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor package designs are used, then manufacturing processes are simpler, but package size is too large and performance is relatively low
Solution Approach 1:
The lead structure is segmented into distinct functional portions: a lead via portion extending through the substrate, a lead trace portion on the surface, and a lead protrusion portion extending outward. This segmentation allows each portion to be optimized independently, reducing overall package size while maintaining electrical functionality.
Solution Approach 2:
The lead structure transitions from traditional planar traces to a three-dimensional configuration with via holes and protrusions extending in multiple dimensions. The lead via penetrates the substrate thickness, and the lead protrusion extends beyond the substrate surface, utilizing vertical space to reduce footprint area.
2Reliability
If conventional lead structures are used, then manufacturing is easier, but electrical coupling is insufficient
Solution Approach 1:
Different portions of the lead structure have different geometries optimized for their specific functions: the lead via has a conical shape to facilitate soldering and electrical connection, the lead trace provides signal routing, and the lead protrusion has an enlarged surface area for enhanced electrical coupling and mechanical attachment. This local optimization improves electrical coupling without requiring complete redesign of the entire manufacturing process.
Data Source
AI summary
An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.