Semiconductor Lead Tape Attachment for Deformation Control
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Solution Overview
Problem
Existing semiconductor device designs face challenges in suppressing lead deformation during manufacturing, particularly at wire connecting portions, due to the limitations of tape attachment methods that either increase the width of suspension leads, reducing terminal density, or fail to prevent tape overlap, leading to unreliable attachment.
Innovation Solution
A semiconductor device configuration featuring a first and second lead group with a suspension lead between them, where tapes are attached to each lead and suspension lead, with specific parts of the tape positioned to prevent overlap and maintain consistent attachment lengths, enhancing the reliability and density of terminal arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If width of suspension lead is increased to attach tape ends, then tape overlap is prevented, but terminal density is reduced
Solution Approach 1:
Instead of increasing suspension lead width, the patent segments the leads into multiple groups with suspension leads positioned between them. Tapes are attached to each group separately, preventing overlap through spatial separation rather than width increase, thus maintaining high terminal density while ensuring reliable tape attachment.
Solution Approach 2:
The patent resolves the tape overlap problem by transitioning from a one-dimensional width adjustment (increasing suspension lead width) to a two-dimensional spatial arrangement (separating tape attachment zones across different lead groups). This dimensional change prevents overlap while maintaining compact terminal density.
2Length of moving object
If wire is coupled to tip end part of lead to shorten wire length, then wire length is reduced, but lead deformation suppression becomes difficult
Solution Approach 1:
The patent applies preliminary action by attaching tapes to leads before wire bonding occurs. The tapes are positioned to suppress lead deformation in advance during subsequent wire bonding and manufacturing processes, enabling wires to be coupled to tip end parts while maintaining deformation suppression through the pre-applied tape constraints.
Data Source
AI summary
An object of the present invention is to improve the reliability of a semiconductor device.A semiconductor device has a first lead group comprised of a plurality of first leads, a second lead group comprised of a plurality of second leads, and a first suspension lead arranged between the first lead group and the second lead group. Further, the semiconductor device has a first tape attached to each of the first leads, the first suspension lead, and some of the second leads, and a second tape attached to each of the second leads. Further, the first tape has a lead holding part attached to each of the first leads, and a tape supporting part attached to the first suspension lead and some of the second leads and is attached to a position farther from wire connecting portion than the lead holding part.