Semiconductor Lead Terminal Wall Portion for Connecting Element Alignment
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Solution Overview
Problem
Conventional semiconductor devices face reliability issues due to misalignment of connecting elements with lead terminals, leading to potential connection failures, which degrade the controllability and reliability of the device.
Innovation Solution
A semiconductor device design that includes a seal portion with a conductive bonding agent and a wall portion on the lead terminal to ensure precise positioning and fixation of the connecting element, preventing misalignment and ensuring reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a concaved portion is formed at the end of the lead terminal to fit the connecting element, then the connecting element can be positioned, but when a horizontal force is applied, the connection becomes unstable and misalignment occurs
Solution Approach 1:
The lead terminal is divided into multiple segments: a body portion and a protruding wall portion that extends from the top surface. This segmentation allows the wall portion to independently provide lateral constraint on the connecting element, separating the positioning function from the stabilizing function and preventing misalignment under horizontal forces.
Solution Approach 2:
The solution transitions from a two-dimensional surface fitting (concaved portion on the top surface) to a three-dimensional constraint by adding a wall portion that protrudes vertically from the top surface. This vertical dimension provides additional constraint in the lateral direction, preventing horizontal displacement and misalignment of the connecting element.
2Reliability
If the lead terminal is sealed with a mold, then the device is protected, but the lead terminal may shift during sealing causing connection failure
Solution Approach 1:
The wall portion is formed on the lead terminal before the sealing process. This preliminary structural feature ensures that when the mold is applied during sealing, the connecting element is already constrained by the wall portion, preventing any shift or misalignment that could occur during the sealing operation.
3Reliability
If the connecting element is joined to the lead terminal, then electrical connection is established, but the joining position must be precisely controlled to prevent misalignment
Solution Approach 1:
The wall portion on the lead terminal serves as a self-aligning feature that automatically guides and constrains the connecting element to the correct position during the joining process. The connecting element naturally fits against the wall portion, ensuring precise joining position without requiring additional positioning mechanisms or high-precision alignment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of semiconductor devices by ensuring that connecting elements are securely joined to lead terminals at predetermined positions, preventing connection failures and enhancing the overall reliability of the device.
Implementation Method 1
the conductive bonding agent that is melt during joining of the other end of the first connecting element and the one end of the second lead terminal
Implementation Method 2
a conductive bonding agent for joining together the other end of the first connecting element and the one end of the second lead terminal in a conductive manner
Implementation Method 3
the conductive bonding agent is in contact with the wall portion due to a surface tension force during the joining
Data Source
AI summary
A semiconductor device includes: a seal portion; a first electronic element; a second lead terminal having one end that is disposed to be close to the one end of the first lead terminal within the seal portion, and another end that is exposed from another end of the seal portion, the other end of the seal portion being along the longitudinal direction; a first connecting element disposed within the seal portion, and having one end that is electrically connected to the first electrode disposed on the first electronic element, and another end that is electrically connected to the one end of the second lead terminal; and a conductive bonding agent.