Semiconductor Lead Configuration for Wire-Bonding Stability
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Solution Overview
Problem
Conventional semiconductor devices face challenges in miniaturization due to lead deformation during wire-bonding and increased package thickness from elevated thin metal wires bonding to child chips, which complicates the bonding process and affects device size and thickness.
Innovation Solution
The semiconductor device design includes leads with exposure and bonding portions positioned on different planes, with continuous portions connecting them, and thin metal wires bonded to side surfaces of the leads, preventing capillary contact with inclined portions and reducing lead deformation. This configuration allows for stable bonding without increasing the device's two-dimensional area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the bonding portion is made small to reduce device size, then the device area is reduced, but the capillary contacts the inclined portion during wire-bonding causing lead deformation
Solution Approach 1:
The bonding portion is positioned on a different plane (vertical dimension) than the exposure portion, allowing the capillary to bond wires without contacting the inclined portion. This spatial separation in the vertical dimension resolves the conflict between small device area and prevention of lead deformation during wire-bonding.
2Adaptability or versatility
If thin metal wires are bonded to child chips to enable stacking, then device functionality is improved, but package thickness increases
Solution Approach 1:
The lead is segmented into distinct portions: bonding portion, exposure portion, and inclined portion. This segmentation allows the bonding portion to be positioned on a different plane, enabling wire-bonding to child chips for stacking while maintaining a compact overall package thickness by utilizing the vertical space efficiently.
3Device complexity
If the bonding portion is positioned on the same plane as the island to simplify structure, then structural simplicity is improved, but the capillary contacts the inclined portion causing deformation
Solution Approach 1:
Instead of maintaining simple coplanar arrangement, the bonding portion is moved to a different plane (vertical dimension), adding spatial complexity but eliminating lead deformation. This dimensional change resolves the contradiction by allowing structural simplicity in horizontal layout while achieving manufacturing precision through vertical positioning.
Data Source
AI summary
Provided is a semiconductor device which is small in size and in which the deformation of leads is prevented at the time of wire-bonding. The semiconductor device includes: an island; a semiconductor element mounted on the bottom surface of the island; leads provided close to the island; and a sealing resin for integrally sealing these constituents. Moreover, in the semiconductor device according to the present invention, electrodes on the semiconductor element are bonded to the leads provided adjacent to a side of the island, the side not provided with leads which extends continuously from the island.