Semiconductor Lead Layout for Shorter Bond Wires and Less Wire Sweep
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Solution Overview
Problem
Conventional semiconductor devices face issues with wire sweep and inefficient bonding of wires due to the arrangement of bonding wires, which can lead to increased wire length and interference when the number of wires increases, affecting the semiconductor element's performance.
Innovation Solution
The semiconductor device employs a configuration where the second lead includes interconnected portions that allow for perpendicular bonding of wires, preventing wire sweep and enabling efficient bonding, thereby increasing the number of wires that can be bonded to supply larger currents to the semiconductor element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of wires bonded to the semiconductor element increases, then the current supply capability is improved, but the wire length increases and wire sweep occurs
Solution Approach 1:
The patent introduces a second lead extending in a direction perpendicular to the first lead, utilizing spatial dimensionality change to provide additional bonding positions. This allows wires to be arranged in multiple rows without increasing wire length, as wires can now bond to leads in different spatial dimensions rather than only extending in one direction.
Solution Approach 2:
The patent divides the lead structure into multiple segments (first lead and second lead extending in perpendicular directions), creating multiple bonding regions. This segmentation allows wires to be distributed across different lead segments, reducing the need for excessively long wires while increasing the total number of wires that can be bonded to the semiconductor element.
2Quantity of substance
If wires are arranged in multiple rows to avoid interference, then the number of wires is increased, but the wire sweep occurs due to increased wire length
Solution Approach 1:
By extending the second lead in a direction perpendicular to the first lead, the patent creates a two-dimensional lead arrangement. This dimensional change allows wires to be organized in multiple rows with shorter individual lengths, as each wire can connect to nearby bonding positions on different leads rather than requiring long spans across a single lead, thereby preventing wire sweep.
Solution Approach 2:
The patent creates different local bonding regions on the first and second leads, where each region is optimized for specific wire connections. This local quality approach ensures that wires in different rows have appropriate lengths for their specific bonding positions, preventing wire sweep while maintaining the ability to bond multiple wires to the semiconductor element.
3Power
If the number of wires is increased to supply larger currents, then the current supply capability is improved, but the wire arrangement becomes complex and interference increases
Solution Approach 1:
The perpendicular extension of the second lead creates a structured two-dimensional wire arrangement pattern. This dimensional organization simplifies the overall complexity by providing clear spatial separation for wires in different rows, making the wire arrangement more manageable and reducing interference compared to a single-directional lead structure that would require more complex routing.
Data Source
AI summary
A semiconductor device includes first and second leads, a semiconductor element, and conductive members. The first lead includes a base including a first surface on which the semiconductor element is mounted. Each conductive member includes first and second end portions. The semiconductor element includes first and second obverse-surface electrodes formed on an element obverse surface. A first end portion of each conductive member is bonded to the first or the second obverse-surface electrode. The second lead includes first and second portions of an elongated shape. In plan view, the first portion is located on a first side in a first direction with respect to the base. The second portion is located on a first side in a second direction with respect to the base, extending in the first direction. The conductive members include a first conductive member whose second end portion is bonded to the second portion.