Semiconductor Light Emitting Device Package Co-Firing

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Solution Overview

Problem

The manufacturing costs and time for semiconductor light emitting device packages are high due to complex processes and material costs, limiting mass production efficiency.

Innovation Solution

A method involving the use of a mixture containing a wavelength conversion material and a glass composition, including Na2O, CaO, K2O, and Li2O, is applied to semiconductor light emitting structures, which are then sintered and shaped to form a wavelength conversion part, reducing substrate reliance and enabling efficient cutting into individual units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional manufacturing processes are used for semiconductor light emitting device packages, then manufacturing precision and reliability are maintained, but manufacturing costs and time increase significantly

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidprocess complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent combines the wavelength conversion layer and encapsulation layer into a single integrated structure formed by co-firing ceramic green sheets. This merging of functions reduces the number of separate manufacturing steps, eliminates intermediate handling, and simplifies the overall process while maintaining the functional integrity of both layers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The ceramic green sheet composition serves multiple functions simultaneously: it provides the wavelength conversion layer, the encapsulation layer, and the structural support. This multi-functionality eliminates the need for separate layers and processes, directly reducing manufacturing complexity and time.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If multiple separate layers are used for wavelength conversion and encapsulation, then functional performance is optimized, but manufacturing time and cost increase

Engineering Contradiction:

Improvefunctional performanceVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent forms both the wavelength conversion layer and encapsulation layer as integrated components within the ceramic green sheet structure, eliminating the need for separate layer deposition and assembly steps. This single-step formation process maintains functional performance while significantly reducing manufacturing time.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If complex packaging structures are used, then device reliability is improved, but material costs and processing complexity increase

Engineering Contradiction:

Improvedevice reliabilityVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent uses composite ceramic green sheets that integrate multiple functional materials (wavelength conversion phosphors, encapsulation matrix, and structural ceramics) into a single homogeneous material system. This composite approach maintains device reliability through proper material composition while simplifying manufacturing to a single co-firing process.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The ceramic green sheet material system performs multiple functions simultaneously: structural support, wavelength conversion, and encapsulation. This multi-functionality reduces the number of separate components and assembly steps, making manufacturing easier while maintaining comprehensive device reliability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Stability of the object's composition

If traditional sintering processes are used, then material properties are preserved, but manufacturing cost and energy consumption increase

Engineering Contradiction:

Improvematerial stabilityVSAvoidmanufacturing efficiency

Core Design Contradiction:

Stability of the object's compositionVSProductivity

Solution Approach 1:

The patent employs co-firing technology that allows simultaneous sintering of multiple ceramic layers at optimized temperature and time parameters. By changing and optimizing the sintering parameters (temperature profile, atmosphere, timing), the process achieves rapid processing while preserving material properties and enabling mass production efficiency.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs and time by simplifying the process, enhancing light extraction efficiency, and allowing for the production of high-efficiency semiconductor light emitting device packages with reduced material degradation.

Implementation Method 1

sintering the mixture to form a wavelength conversion part

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS10121934B2Method for manufacturing semiconductor light emitting device package

Publication Date: 2018.11.06 SAMSUNG ELECTRONICS CO LTD

AI summary

There is provided a method for manufacturing a semiconductor light emitting device package including steps of disposing a plurality of light emitting structures on a support substrate, each light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, shaping a mixture containing a wavelength conversion material and a glass composition on the plurality of light emitting structures, sintering the mixture to form a wavelength conversion part, removing the support substrate, and cutting the plurality of light emitting structures into individual device units.